Semiconductor package having low side field-effect transistor chips of different sizes and method of making the same

Abstract

A semiconductor package comprises a lead frame, a high side chip, a first low side chip, a second low side chip, a first metal clip, a second metal clip, an integrated circuit (IC), and a molding encapsulation. A method comprises the steps of providing a lead frame; mounting a high side chip, a first low side chip, and a second low side chip; mounting a first metal clip and a second metal clip; mounting an IC; forming a molding encapsulation; and applying a singulation process.

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