Electronic package and substrate structure thereof

Abstract

The invention discloses an electronic package and its substrate structure, wherein the substrate structure includes a substrate body and a surface circuit. The substrate body has a first side and a second side opposite to each other. The first side defines a die placement area and a peripheral area adjacent to the die placement area, the second side defines a projected die placement area and a projection peripheral area adjacent to the projected die placement area, the corner of the projected die placement area corresponding to the projected die placement area is defined with stress concentration area, and a stress extension line is further defined in the stress concentration area, so that the layout direction of the surface circuit formed on the second side of the substrate body does not overlap with the stress extension line, so as to avoid damage to the surface circuit.

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