Package comprising inter-substrate gradient interconnect structure
Gradient interconnect structures between substrates, featuring diagonal, horizontal, and vertical interconnects, address the challenge of achieving robust and compact packaging solutions by reducing thickness and metal layer requirements, resulting in reliable and compact package configurations.
Patent Information
- Application Number
- TW114150437
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-11-10
- Filing Date
- 2021-10-14
- Publication Date
- 2026-08-01
AI Technical Summary
There is a continued demand for robust and reliable packaging solutions with a small form factor, particularly in the context of integrated components and substrates, where existing technologies struggle to achieve both reliability and compactness effectively.
The implementation of gradient interconnect structures between substrates, which include encapsulation layers with continuous interconnects extending diagonally, horizontally, and vertically, reducing the spatial thickness and overall height of the package by utilizing leadframe interconnects and encapsulation layers formed through molding processes.
This approach results in a robust and reliable package configuration with reduced thickness, achieved by minimizing the need for metal layers and optimizing the spatial arrangement of interconnects, thereby enhancing the compactness of the package.