Package comprising inter-substrate gradient interconnect structure
TW202633500APending Publication Date: 2026-08-01QUALCOMM INC
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- QUALCOMM INC
- Filing Date
- 2021-10-14
- Publication Date
- 2026-08-01
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Abstract
A device comprising a first package and a second package coupled to the first package. The first package includes a first substrate, at least one gradient interconnect structure coupled to the first substrate, and a first integrated device coupled to the first substrate. The second package includes a second substrate and a second integrated device coupled to the second substrate. The second substrate is coupled to the at least one gradient interconnect structure.
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