Semiconductor device, substrate unit and manufacturing method of substrate unit

Abstract

One embodiment provides a semiconductor device, a substrate unit, and a method for manufacturing the semiconductor device, all capable of suppressing malfunctions. The semiconductor device of one embodiment includes a substrate, electronic components, a plurality of bonding portions, and a first metal portion. The substrate has a first surface, a second surface located opposite to the first surface, and a first side surface spanning a first edge of the first surface and a second edge of the second surface. The electronic components are mounted on the second surface. The plurality of bonding portions are provided on the first surface, including a first bonding portion. The first metal portion includes a first portion extending along the first surface and a second portion extending along the first side surface. The area of ​​the first metal portion, viewed from a first direction which is the thickness direction of the substrate, is larger than that of the first bonding portion.

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