Semiconductor packaging and methods for manufacturing semiconductor packaging

TW202633503APending Publication Date: 2026-08-01SONY SEMICON SOLUTIONS CORP
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Patent Information

Application Number
TW114140193
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-10-17
Publication Date
2026-08-01

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Abstract

The objective of this invention is to prevent defects caused by cracks in WLCSP (Wastewater Crush Semiconductor Package). The semiconductor package of this invention includes: a semiconductor substrate, an insulating film and back-side wiring, a guard ring, and a protective film. In this semiconductor package, the insulating film and back-side wiring are formed in the wiring area on the back side of the semiconductor substrate. Furthermore, in the semiconductor package, a guard ring is formed around the back-side wiring. Also, in the semiconductor package, the protective film covers the guard ring, the insulating film, and the back-side wiring.
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