Semiconductor structures and package structures
TW202633505APending Publication Date: 2026-08-01ENNOSTAR CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- ENNOSTAR CORP
- Filing Date
- 2025-01-23
- Publication Date
- 2026-08-01
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Abstract
A semiconductor structure includes a first surface, a second surface, a semiconductor portion and a penetrating portion. The second surface is opposite to the first surface. The penetrating portion passes through the semiconductor portion, and has a first opening located on the first surface and a second opening located on the second surface. The penetrating portion allows an ambient medium to pass through the semiconductor portion through the first opening and the second opening.
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