Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a redistribution structure, a first electronic component disposed over the redistribution structure, and a second electronic component disposed adjacent the first electronic component and over the redistribution structure. An encapsulant can be disposed around lateral sides of the first electronic component and the second electronic component. A metallic structure is disposed over the encapsulant and the first electronic component, and a first CTE above a beam-neutral axis of the electronic device is balanced with a second CTE below the beam-neutral axis of the electronic device. Other examples and related methods are also disclosed herein.

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