Package for semiconductor die, structure, and method

TW202633508APending Publication Date: 2026-08-01SEMICON COMPONENTS IND LLC
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
SEMICON COMPONENTS IND LLC
Filing Date
2025-05-06
Publication Date
2026-08-01

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Abstract

A device may include a substrate. A device may include a metal portion of the package coupled to the substrate, the metal portion configured to function as an electrical connection from the semiconductor die. A device may include a dies area on the substrate. A device may include a barrier surrounding at least a portion of the die area. A device may include a flexible material disposed between the die area and the barrier. A device may include an encapsulant surrounding the substrate and the metal portion of the package.
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