Manufacturing method of packaging substrate and packaging substrate using the same

Abstract

The present disclosure relates to a method for manufacturing a packaging substrate and a packaging substrate using the method. A packaging substrate according to the present disclosure includes a core layer and an upper layer disposed on the core layer, the core layer including a glass core having a first face and a second face facing each other, the upper layer including: a first distribution layer formed on the core layer; and a dummy layer formed on the first distribution layer, wherein the dummy layer may include a material having a lower coefficient of thermal expansion (CTE) than the insulating material of the first distribution layer. By placing a non-shrinking dummy layer between the distribution layers, the curing shrinkage of the distribution layers located between the dummy layer and the core layer can be alleviated, and the effect of lowering the stress concentrated in the core layer can be achieved.

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