Method and system of manufacturing package structure

Abstract

An embodiment of the present disclosure relates to a method of manufacturing a package structure, which includes providing a substrate in a molding machine and preheating the substrate in a non-contact manner. Another embodiment of the present disclosure includes a system for manufacturing a packaging structure.

Description

[Technical Field]

[0001] This invention relates to a method for manufacturing a packaging structure, and more specifically to a method for manufacturing a substrate including a preheating step. [Previous Technology]

[0002] In the molding process, to form a molding compound on a glass substrate, the room-temperature glass substrate needs to be loaded onto the upper mold of a molding machine at a higher temperature. After the molding compound is poured into the lower mold, the lower mold and the upper mold are then closed. As semiconductor packaging structures use more redistribution layers (RDLs), the coefficient of thermal expansion (CTE) of the glass substrate is also higher (e.g., higher than 8 ppm / °C) to accommodate higher stress. However, the glass substrate may warp due to the high CTE, making it difficult to load onto the upper mold, and may even crack. [Summary of the Invention]

[0003] One embodiment of this disclosure relates to a method of manufacturing a package structure, including providing a substrate in a molding machine and preheating the substrate in a manner that does not contact the substrate.

[0004] One embodiment of this disclosure relates to a method of manufacturing a package structure, including providing a substrate in a molding machine, wherein the substrate has a first surface and a second surface opposite to the first surface; and preheating the substrate from the first surface and the second surface.

[0005] One embodiment of this disclosure relates to a system for manufacturing a package structure, including a molding machine having an upper mold and a lower mold, wherein the upper mold and the lower mold are configured to preheat the substrate from different sides of a substrate, respectively. The system also includes a fixture configured to hold the substrate in a preheated position for a period of time.

Implementation Method

[0006] Figure 1 is a cross-sectional view of a system 1 for manufacturing a package structure according to some embodiments of the present disclosure. In some embodiments, system 1 can be applied to perform processes for manufacturing semiconductor devices, such as (but not limited to) molding processes, injection molding processes, compression molding processes, casting processes, die-casting processes, or other processes that utilize heating, pressure, or melting to achieve a molding effect. For example, system 1 can be configured to form a package (package 16 as shown in Figure 2I) on a substrate 13.

[0007] In some embodiments, system 1 may include a molding machine, a fixture 12, and a controller 14. The molding machine may include a lower mold 10 and an upper mold 11.

[0008] The lower mold 10 may include a platform 10a, a protrusion 10b, and a sidewall 10w. The platform 10a may be located at the center or middle of the lower mold 10, and the protrusion 10b may be located around or at the edge of the platform 10a. In a side view, the protrusion 10b may be located on both sides of the platform 10a. In some embodiments, the protrusion 10b may surround the platform 10a.

[0009] When the substrate 13 is placed in the system 1, the substrate 13 may be positioned directly above the platform 10a. For example, the substrate 13 and the platform 10a may substantially overlap in a direction perpendicular to the surface 10a1 of the platform 10a. In some embodiments, the substrate 13 and the protrusion 10b may also partially overlap in a direction perpendicular to the surface 10a1 of the platform 10a. However, in other embodiments, the substrate 13 and the protrusion 10b may not overlap in a direction perpendicular to the surface 10a1 of the platform 10a. For example, the projected area of ​​the substrate 13 on the surface 10a1 of the platform 10a may be entirely within the platform 10a.

[0010] Platform 10a may be configured to preheat or heat substrate 13. For example, when substrate 13 is placed in system 1 for a molding process, platform 10a may be at a higher temperature than substrate 13. In some embodiments, platform 10a may have a substantially planar surface 10a1 to uniformly preheat or heat substrate 13. In some embodiments, surface 10a1 may be substantially parallel to surface 131 of substrate 13 to uniformly preheat or heat substrate 13.

[0011] The protrusion 10b may protrude above or relative to the platform 10a to provide a surface for placing the fixture 12. For example, the fixture 12 may be mounted or supported on the protrusion 10b without contacting (e.g., not physically contacting or directly contacting) the platform 10a. In this way, the fixture 12 can separate the substrate 13 from a portion of the lower mold 10 (e.g., the platform 10a).

[0012] The upper mold 11 may include a platform 11a, a protrusion 11b, and a sidewall 11w. The platform 11a may be located at the center or middle of the upper mold 11, and the protrusion 11b may be located around or at the edge of the upper mold 11. In a side view, the protrusion 11b may be located on both sides of the platform 11a. In some embodiments, the protrusion 11b may surround the platform 11a.

[0013] Platform 11a may be configured to preheat or heat substrate 13. For example, when substrate 13 is placed in system 1 for a molding process, platform 11a may be at a higher temperature than substrate 13. In some embodiments, the temperatures of platform 11a and platform 10a may be substantially equal. In some embodiments, the temperature of platform 11a may be lower than the temperature of platform 10a. In some embodiments, the temperature of platform 11a may be higher than the temperature of platform 10a. The temperatures of platform 11a and platform 10a may be adjusted to uniformly preheat or heat substrate 13 from different surfaces (e.g., surface 131 and surface 132) of substrate 13.

[0014] In some embodiments, the platform 11a may have a substantially planar surface 11a1 to uniformly preheat or heat the substrate 13. In some embodiments, the surface 11a1 may be substantially parallel to the surface 132 of the substrate 13 to uniformly preheat or heat the substrate 13.

[0015] In some embodiments, the dimensions (e.g., area or width) of the surface 11a1 of platform 11a may be greater than, less than, or substantially equal to the dimensions (e.g., area or width) of the surface 10a1 of platform 10a. The surfaces 11a1 of platform 11a and 10a1 of platform 10a may be adjusted to uniformly preheat or heat the substrate 13 from different surfaces (e.g., surfaces 131 and 132) of the substrate 13.

[0016] The bottom of the protrusion 11b may be lower than or protrude relative to the platform 11a. When preheating or heating the substrate 13, the protrusion 11b may not contact (e.g., not physically or directly contact) the fixture 12. However, during package molding, the protrusion 11b may resist a release agent (e.g., release agent 15 shown in FIG. 2I). In some embodiments, the protrusion 11b may be configured to determine the thickness of the product package.

[0017] In some embodiments, the lower mold 10 and the upper mold 11 may be configured to approach each other to form a cavity or to move away from each other to open a cavity. For example, the upper mold 11 may be fixed or stationary, and the lower mold 10 may be movable to the upper mold 11. For example, the lower mold 10 may be fixed or stationary, and the upper mold 11 may be movable to the lower mold 10. For example, the lower mold 10 and the upper mold 11 may be movable relative to each other. In some embodiments, the sidewalls 10w and 11w may be configured to approach each other to form a cavity or to move away from each other to open a cavity.

[0018] In some embodiments, the lower mold 10 may be configured to carry the fixture 12 and the substrate 13, and move the fixture 12 and the substrate 13 toward the upper mold 11 to perform a preheating or heating step of the substrate 13 (as shown in Figures 2B to 2C).

[0019] The fixture 12 may be configured to carry the substrate 13. The fixture 12 may be configured to contact (e.g., physically or directly contact) the surface 131 of the substrate 13. The fixture 12 may be configured to transfer heat energy from the platform 10a to the substrate 13. The fixture 12 may be configured to hold the substrate 13 in a preheated or heated position. The fixture 12 may be configured to preheat or heat together with the substrate 13 in a molding machine. In some embodiments, the fixture 12 may include a metallic material, such as copper, tin, zinc, gold, other feasible metals or alloys. In some embodiments, the fixture 12 may not include plastic.

[0020] Further, please refer to Figures 3A and 3B. Figures 3A and 3B show a top view and a bottom view of a fixture 12 according to some embodiments of the present disclosure. In some embodiments, the fixture 12 may include a hollow structure and may support the substrate 13 from the edge of the substrate 13. In some embodiments, the front side of the fixture 12 may have a groove for receiving the substrate 13. In some embodiments, the back side of the fixture 12 may have a groove for receiving the protrusion 10b. The fixture 12 shown in Figures 4A and 4B is similar to the fixture 12 shown in Figures 3A and 3B, except that Figures 4A and 4B depict a generally rectangular fixture 12. The shape or size of the fixture 12 may be adjusted according to the molding machine and the substrate 13, and is not limited to the form disclosed in this invention.

[0021] When preheating or heating the substrate 13, the substrate 13 may not contact (e.g., not physically or directly) the molding machine. For example, the surface 131 of the substrate 13 may contact (e.g., physically or directly) the fixture 12. The fixture 12 may be configured to separate the substrate 13 from a portion of the lower mold 10 (e.g., platform 10a) such that the surface 10a1 of the platform 10a does not contact (e.g., not physically or directly) the surface 131 of the substrate 13.

[0022] A gap g1 may be separated between the surface 10a1 of the platform 10a and the fixture 12. Air or other heat-conducting gases may be present in the gap g1. The heat energy of the platform 10a can be conducted to the substrate 13 via the air (e.g., through thermal radiation, without the need for a medium to transfer heat) and the fixture 12. In some embodiments, if the fixture 12 is a hollow structure (e.g., as shown in Figures 3A and 3B), the gap g1 may represent the distance between the surface 10a1 of the platform 10a and the surface 131 of the substrate 13.

[0023] A gap g2 may be separated between the surface 11a1 of the platform 11a and the surface 132 of the substrate 13. Air or other heat-conducting gases may be present in the gap g2. The heat energy of the platform 11a may be conducted to the substrate 13 via the air (e.g., through thermal radiation). In some embodiments, the gap g1 and the gap g2 may be substantially equal when preheating or heating the substrate 13. In some embodiments, the gap g1 may be greater than the gap g2 when preheating or heating the substrate 13. In some embodiments, the gap g1 may be less than the gap g2 when preheating or heating the substrate 13. The gaps g1 and g2 may be adjusted to uniformly preheat or heat the substrate 13 from different surfaces (e.g., surface 131 and surface 132).

[0024] In some embodiments, substrate 13 may include a glass substrate, a semiconductor substrate, an organic substrate, a ceramic substrate, or other substrates or carriers that can be used for molding processes in system 1. In some embodiments, the coefficient of thermal expansion (CTE) of substrate 13 may be approximately equal to or greater than 8 ppm / °C.

[0025] The substrate 13 may have a surface 131 (or referred to as a first surface, front surface, active surface, or powered surface) and a surface 132 opposite to the surface 131 (or referred to as a second surface, back surface, non-active surface, or passive surface). The substrate 13 may have a circuit (not shown) adjacent to the surface 131. The circuit may have a conductive structure, including (but not limited to) one or more redistribution layers (RDLs), one or more metal layers, one or more traces, one or more electrical contacts, and / or one or more conductive vias.

[0026] In some embodiments, the controller 14 may include (but is not limited to) hardware, software, firmware, or any combination thereof associated with a computer or server. For example, the controller 14 may include (but is not limited to) software running on a computer, a computer running the software, or both the software and the computer. In some embodiments, the computer and server may have one or more processors and be configured to execute computer-executable instructions stored in memory, and the processors may include integrated electronic circuits that perform logical operations using electronic signals. In some embodiments, the controller 14 may include (but is not limited to) input devices, output devices, a processor, and memory. In some embodiments, the controller 14 may be configured to be electrically connected to the lower mold 10 and the upper mold 11, and configured to control the flow of the molding process of the system 1. For example, the flow shown in FIG2 may be implemented through executable code encoded in non-volatile, processor-readable memory.

[0027] The implementation of System 1 will now be described with reference to FIGS. 2A to 2I. For example, a method for manufacturing a package structure can be implemented through System 1. The same elements as those in FIG. 1 in FIGS. 2A to 2I are indicated by the same reference numerals.

[0028] Referring to FIG2A, the method may include providing a substrate 13 on a fixture 12. The surface 131 of the substrate 13 may contact (e.g., physically or directly contact) the fixture 12. The method may also include placing the substrate 13 and the fixture 12 on a lower mold 10 using a clamp 20. The fixture 12 may be mounted or supported on the protrusion 10b and may not contact (e.g., not physically or directly contact) the platform 10a. In this way, the fixture 12 may separate the substrate 13 from a portion of the lower mold 10 (e.g., the platform 10a).

[0029] Referring to FIG2B, the method may include removing the clamp 20 from the fixture 12.

[0030] Referring to FIG2C, the method may include moving the substrate 13 to a first position (or preheating position). For example, moving the lower mold 10 toward the upper mold 11, so that the substrate 13 and the fixture 12 move together to the first position.

[0031] In the first position, the substrate 13 does not contact (e.g., not physically or directly) the platform 10a, nor does it contact (e.g., not physically or directly) the platform 11a. Heat energy from the platform 10a can be conducted to the substrate 13 via air and the fixture 12, while heat energy from the platform 11a can be conducted to the substrate 13 via air. The fixture 12 can be configured to hold the substrate 13 in the first position for a period of time until the substrate 13 reaches a preheated or heated temperature. The fixture 12 can be configured to be preheated or heated together with the substrate 13. In some embodiments, the fixture 12 can be configured to hold the substrate 13 in the first position for a period of time until the substrate 13 returns to a flat or level state.

[0032] In some embodiments, the method may include measuring the temperature of the substrate 13 (e.g., the temperature relative to the surface 10a1) to determine whether the preheating step has been completed. In some embodiments, the method may include measuring the flatness of the substrate 13 (e.g., the flatness relative to the surface 10a1) to determine whether the preheating step has been completed.

[0033] Referring to FIG2D, the method may include moving the substrate 13 to a second position (or forming position) when the substrate 13 reaches a preheating or heating temperature (or returns to a flat or level state). In the second position, the surface 132 of the substrate 13 contacts (e.g., physically contacts or directly contacts) the surface 11a1 of the platform 11a. In some embodiments, the substrate 13 may be adsorbed onto the surface 11a1 of the platform 11a by vacuum adsorption.

[0034] In some embodiments, the substrate 13 does not contact (e.g., does not physically contact or directly contact) the surface 11a1 of the platform 11a before the substrate 13 reaches a preheating or heating temperature (or before returning to a flat or level state).

[0035] Referring to Figures 2E, 2F and 2G, the method may include opening the chamber and removing the fixture 12 from the lower mold 10 using the jig 20.

[0036] Referring to FIG2H, the method may include placing a release agent 15 in the lower mold 10. For example, the release agent 15 may cover the protrusion 11b and the platform 10a. The method may also include filling the lower mold 10 with material for the encapsulation 16. In some embodiments, the encapsulation 16 may include (but is not limited to) one or more organic materials (e.g., molding compound, polyimide (PI), polybenzoxazole (PBO), solder resist, epoxy-based materials, or combinations thereof), inorganic materials (e.g., silicon, glass, ceramic, quartz, or combinations thereof), liquids, dry film materials, or combinations thereof. The encapsulation 16 may be placed in the groove formed by the protrusion 11b of the lower mold 10.

[0037] In some embodiments, the method may further include preheating or heating the package 16 so that the temperature of the package 16 is substantially equal to the temperature of the substrate 13.

[0038] Referring to FIG2I, the method may include contacting the package 16 with the substrate 13 to form the package 16 on the surface 131 of the substrate 13. In some embodiments, when the package 16 contacts the substrate 13, the temperatures of the two may be substantially equal.

[0039] According to the embodiments disclosed in this invention, the substrate 13 is preheated simultaneously by the lower mold 10 and the upper mold 11 in a non-contact manner (e.g., with a gap or interval), which solves the problem that the substrate 13 may warp due to high CTE. Specifically, before loading the substrate 13 onto the upper mold 11, the substrate 13 is first placed on the lower mold 10. Neither the lower mold 10 nor the upper mold 11 directly contacts the substrate 13. The heat energy of the lower mold 10 and the upper mold 11 is conducted by air, so that different surfaces of the substrate 13 (e.g., surface 131 and surface 132) are preheated evenly. After the substrate 13 naturally returns to a flat state, the substrate 13 is then loaded onto the upper mold 11 to continue the subsequent molding process of the package 16.

[0040] Embodiments of the systems and methods discussed herein are not limited to the details of the construction and / or configuration described herein or illustrated in the figures, but can be practiced or performed in various ways. The specific embodiments described herein are merely illustrative and are not intended to limit the invention.

[0041] Unless otherwise specified, spatial descriptions such as "above," "below," "upper," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper part," "above," and "below" are used to indicate directions relative to those shown in the figures. It should be understood that the spatial descriptive terms used herein are for illustrative purposes only, and the actual implementation of the structures described herein can be spatially configured in any orientation or manner, provided that the advantages of the embodiments of the invention are not deviated from by such configuration.

[0042] As used herein, the terms “approximately,” “substantially,” “basically,” “about,” and “approximately” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to instances where the event or situation occurred precisely or instances where the event or situation is very close to occurring. For example, when used in conjunction with numerical values, these terms may refer to a range of variation less than or equal to ±10% of the numerical value, such as a range of variation less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the first value is within ±10% of the second value, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%, then the first value can be considered "substantially" the same as or equal to the second value. For example, "substantially" perpendicular can refer to an angle variation of less than or equal to ±10° relative to 90°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°.

[0043] If the displacement between two surfaces is not greater than 5 µm, not greater than 2 µm, not greater than 1 µm, or not greater than 0.5 µm, then the two surfaces can be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is not greater than 5 µm, not greater than 2 µm, not greater than 1 µm, or not greater than 0.5 µm, then the surface can be considered substantially flat.

[0044] Unless the context clearly indicates otherwise, as used herein, the singular terms “a” and “the” may include a plural indicator.

[0045] Quantities, ratios and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity and should be flexibly interpreted as including not only the values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within that range, as if each value and subrange were explicitly specified.

[0046] Furthermore, the wording and terminology used herein are illustrative only and are not intended to limit the invention. The singular or plural forms are illustrative only and are not intended to limit the system or method, elements, components, or steps of the invention. The terms "comprising," "including," "having," "containing," "referring to," and other similar terms used herein cover the items, equivalents, and additional items listed thereafter. "or" and other similar terms may be construed as indicating any of the described items.

[0047] Although the present invention has been described and illustrated with reference to its specific configuration, such description and illustration are not limiting. Those skilled in the art will understand that various changes and equivalent substitutions can be made without departing from the true spirit and scope of the invention as defined by the appended claims. The drawings may not be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present invention and actual equipment. Other embodiments of the invention may exist that are not specifically described. The specification and drawings should be considered illustrative rather than limiting. Modifications can be made to adapt specific situations, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are considered to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or rearranged to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention. [Simplified Explanation of the Diagram]

[0048] Various embodiments are discussed below with reference to the accompanying drawings, which are not drawn to scale and are merely illustrative and do not limit the scope of the invention. The element symbols used in the drawings and description are merely illustrative and do not limit the scope of the invention. Identical or similar elements are represented by the same element symbols, wherein:

[0049] Figure 1 is a cross-sectional view of a system for manufacturing a packaging structure according to some embodiments of the present disclosure;

[0050] Figure 2A shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0051] Figure 2B shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0052] FIG2C shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0053] Figure 2D shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0054] Figure 2E shows a cross-sectional view of one or more steps in a method of manufacturing a package structure according to some embodiments of the present disclosure;

[0055] Figure 2F shows a cross-sectional view of one or more steps in a method of manufacturing a package structure according to some embodiments of the present disclosure;

[0056] Figure 2G shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0057] Figure 2H shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0058] Figure 2I shows a cross-sectional view of one or more steps in a method of manufacturing a packaging structure according to some embodiments of the present disclosure;

[0059] Figure 3A shows a top view of a fixture according to some embodiments of the present disclosure;

[0060] Figure 3B shows a bottom view of a fixture according to some embodiments of the present disclosure;

[0061] Figure 4A shows a top view of a fixture according to some embodiments of the present disclosure; and

[0062] Figure 4B shows a bottom view of a fixture according to some embodiments of the present disclosure.

Claims

1. A method of manufacturing a package structure, comprising: providing a substrate on a fixture, wherein an active surface of the substrate contacts the fixture; placing the substrate and the fixture on a lower mold of a molding machine, wherein the fixture is configured to separate the substrate from the lower mold; and preheating the substrate in a manner that does not contact the substrate.

2. The method as described in claim 1, further comprising: The substrate is moved to a first position, wherein the substrate is not in contact with an upper mold of the molding machine.

3. The method as described in claim 2, wherein when the substrate is in the first position, the heat energy of the lower mold is conducted to the substrate via air and the fixture.

4. The method as described in claim 2, wherein when the substrate is in the first position, the heat energy of the upper mold is conducted to the substrate via air.

5. The method as described in claim 2, wherein when the substrate is in the first position, a distance between the fixture and the lower mold is greater than a distance between the substrate and the upper mold.

6. The method as described in claim 2, further comprising: When the substrate reaches a preheating temperature, the substrate is moved to a second position, wherein the substrate contacts the upper mold in the second position.

7. The method as described in claim 6, wherein a passive surface of the substrate contacts the upper mold.

8. A system for manufacturing a package structure, comprising: a molding machine having an upper mold and a lower mold, wherein the upper mold and the lower mold are configured to preheat the substrate from different sides of a substrate, respectively; and a fixture configured to hold the substrate in a preheated position for a period of time, wherein the lower mold has a platform and a protrusion, and the fixture is configured to be mounted on the protrusion and not in contact with the platform.

9. The system as described in claim 8, wherein the molding machine is not in contact with the substrate when the substrate is in the preheated position.

10. The system as claimed in claim 8, wherein when the substrate is in the preheated position, the upper mold is configured to conduct heat energy to the substrate via air.

11. The system as described in claim 8, wherein a surface of the platform is substantially parallel to a surface of the substrate.

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