Sensor package structure and manufacturing method thereof

Abstract

The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a ceramic substrate, a sensor chip mounted on and electrically coupled to the ceramic substrate, a ring-shaped supporting layer formed on the sensor chip, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulant that is formed on the ceramic substrate. The ceramic substrate, the sensor chip, the ring-shaped supporting layer, and the light-permeable sheet are embedded in the encapsulant. A bottom surface of the ceramic substrate and at least part of outer surface of the light-permeable sheet are exposed from the encapsulant, and a bottom side of the encapsulant is flush with the bottom surface of the ceramic substrate.

Description

[Technical Field]

[0001] This invention relates to a packaging structure, and more particularly to a sensor packaging structure and its manufacturing method. [Previous Technology]

[0002] The basic architecture used in existing sensor packaging structures is already fixed, thus neglecting improvements to the basic architecture. For example, existing sensor packaging structures form a package on a substrate to protect other components on the substrate, but the substrate is not within the protection range of the package.

[0003] Therefore, the inventors believe that the above-mentioned defects can be improved, and propose an invention that is reasonably designed and effectively improves the above-mentioned defects. [Summary of the Invention]

[0004] The present invention provides a sensor packaging structure and a method for manufacturing the same, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] This invention discloses a method for manufacturing a sensor packaging structure, which includes: a pre-step: providing a plurality of sensing modules, and the manufacturing process of each sensing module includes: mounting a sensing chip and electrically coupling it to a ceramic substrate; An annular support layer is formed on the top surface of the sensing chip; and a light-transmitting sheet is disposed on the annular support layer to form a sensing module; a placement step: placing the ceramic substrates of the plurality of sensing modules on a worktable; a first dispensing step: dispensing adhesive on the worktable to form a barrier wall that surrounds the plurality of sensing modules inside it; a second dispensing step: dispensing adhesive inside the barrier wall of the worktable to form an encapsulation layer that embeds the plurality of sensing modules therein, and at least a portion of the outer surface of the light-transmitting sheet of each sensing module is exposed outside the encapsulation layer; and a cutting step: cutting the encapsulation layer along the outer side of the plurality of sensing modules without touching any of the sensing modules, so that the encapsulation layer forms a plurality of packages that respectively cover the plurality of sensing modules; wherein each sensing module and the corresponding package are collectively defined as a sensor package structure.

[0006] This invention also discloses a sensor packaging structure, comprising: a ceramic substrate having a first plate surface, a second plate surface located on the opposite side of the first plate surface, and an annular side surface connected between the first plate surface and the second plate surface; a sensing chip mounted on the first plate surface of the ceramic substrate, and the sensing chip being electrically coupled to the ceramic substrate; wherein the top of the sensing chip includes a sensing region and a support region surrounding the sensing region; an annular support layer formed on the support region of the sensing chip; and a light-transmitting sheet disposed on the annular support layer. The ceramic substrate comprises a layer; wherein the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together surround and form a closed space, and the sensing area is located within the closed space; and a package is formed on the first plate surface of the ceramic substrate and covers the entire annular side surface, such that the ceramic substrate, the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the package; wherein the second plate surface of the ceramic substrate and at least a portion of the outer surface of the light-transmitting sheet are exposed outside the package, and the bottom edge of the package is flush with the second plate surface of the ceramic substrate.

[0007] In summary, the sensor packaging structure and manufacturing method disclosed in the embodiments of the present invention can achieve better protection effect through the packaging body by adopting the architecture of embedding the remaining components in the packaging body (that is, all components of the sensing module are embedded in the packaging body). For example, the ring side of the ceramic substrate can be completely protected by the packaging body.

[0008] Furthermore, the sensor packaging structure and manufacturing method disclosed in the embodiments of the present invention can, by selecting a ceramic substrate with a small coefficient of thermal expansion, make the ceramic substrate less susceptible to warping due to thermal expansion and contraction of the package, thereby enabling the ceramic substrate to be embedded within the package. In other words, any packaging structure that does not embed a ceramic substrate within the package is different from the sensor packaging structure referred to in this embodiment.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention in any way.

Implementation Method

[0010] The following specific embodiments illustrate the implementation of the "sensor packaging structure and manufacturing method thereof" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0011] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. In addition, the term "or" as used herein may, as appropriate, include any combination of one or more of the associated listed items.

[0012] [Example 1]

[0013] Please refer to Figures 1 to 6, which illustrate Embodiment 1 of the present invention. This embodiment discloses a sensor packaging structure and its manufacturing method. The sensor packaging structure 100 can be manufactured by implementing the sensor packaging structure manufacturing method described in this embodiment, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the sensor packaging structure 100 can also be manufactured by implementing methods other than those in this embodiment. Furthermore, for ease of understanding of this embodiment, the following description will first introduce the sensor packaging structure manufacturing method and then describe the sensor packaging structure 100.

[0014] As shown in Figures 3 to 6, the sensor packaging structure manufacturing method in this embodiment includes a pre-processing step S110, a placement step S120, a first dispensing step S130, a second dispensing step S140, and a cutting step S150. It should be noted that the sensor packaging structure manufacturing method can produce the sensor packaging structure 100 after performing the above steps; therefore, the technical content of the sensor packaging structure manufacturing method can also be found in the relevant description of the sensor packaging structure 100. The following will generally describe the various steps of the sensor packaging structure manufacturing method, but the present invention is not limited thereto.

[0015] The preceding step S110: As shown in Figures 4 and 5, multiple independent sensing modules M are provided. The manufacturing process of each sensing module M includes: mounting and electrically coupling a sensing chip 2 to a ceramic substrate 1; forming an annular support layer 4 on the top surface 21 of the sensing chip 2; and disposing a light-transmitting sheet 5 on the annular support layer 4 to form one sensing module M.

[0016] Further, in this embodiment, the manufacturing process of each of the sensing modules M may further include: after the sensing chip 2 is mounted on the ceramic substrate 1, it is connected to the ceramic substrate 1 and the sensing chip 2 by a plurality of metal lines 3, so that the ceramic substrate 1 and the sensing chip 2 are electrically coupled to each other through the plurality of metal lines 3, but the present invention is not limited thereto. For example, in other embodiments of the present invention not illustrated, the sensing chip 2 may also be mounted and electrically coupled to the ceramic substrate 1 by flip-chip manner as needed.

[0017] The placement step S120: As shown in Figures 4 and 5, the ceramic substrate 1 of the plurality of sensing modules M is placed on a worktable 200. In this embodiment, the plurality of sensing modules M are spaced apart from each other, and the plurality of sensing modules M are preferably arranged in a matrix to facilitate the implementation of the cutting step S150 in the subsequent process (e.g., Figure 6).

[0018] First dispensing step S130: As shown in Figures 4 and 5, a barrier wall 300 is formed by dispensing adhesive on the worktable 200, which surrounds the plurality of sensing modules M inside it. In this embodiment, the distance between the barrier wall 300 and the adjacent sensing module M is preferably no greater than the distance between two adjacent sensing modules M, and the top edge of the barrier wall 300 is preferably no higher than the outer surface 51 of the light-transmitting sheet 5 of each sensing module M relative to the worktable 200, but the present invention is not limited thereto.

[0019] Second dispensing step S140: As shown in FIG6, an encapsulation layer 60 is formed by dispensing adhesive within the barrier wall 300 of the workbench 200, in which a plurality of sensing modules M are embedded, and at least a portion of the outer surface 51 of the light-transmitting sheet 5 of each sensing module M is exposed outside the encapsulation layer 60.

[0020] Further, before the second dispensing step S140 is implemented, the top edge of the barrier wall 300 can be made not higher than the outer surface 51 of the light-transmitting sheet 5 of each of the sensing modules M, so that the second dispensing step S140 can effectively control the encapsulation layer 60 from spreading to the outer surface 51 of any of the light-transmitting sheets 5 when it is implemented.

[0021] The cutting step S150: As shown in FIG6, the encapsulation layer 60 is cut along the outer side of the plurality of sensing modules M without touching any of the sensing modules M, so that the encapsulation layer 60 forms a plurality of encapsulation bodies 6 respectively covering the plurality of sensing modules M. Each sensing module M and its corresponding encapsulation body 6 are collectively defined as a sensor encapsulation structure 100 (e.g., FIG3).

[0022] It should be noted that in any of the sensor packaging structures 100 in this embodiment, the two top edge regions 61 of the package body 6 located on opposite sides of the light-transmitting sheet 5 are arranged asymmetrically with respect to the light-transmitting sheet 5 (e.g., the included angle formed between the two top edge regions 61 and the outer surface 51 of the light-transmitting sheet 5 is slightly different), but the present invention is not limited thereto.

[0023] As described above, the sensor packaging structure manufacturing method has been generally explained in the above content of this embodiment. The following content will then describe the sensor packaging structure 100 formed after the implementation of the sensor packaging structure manufacturing method. Therefore, some technical features of the sensor packaging structure 100 can also be referred to the above content, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the sensor packaging structure 100 can also be obtained by implementing other methods according to actual needs.

[0024] As shown in Figures 1 to 3, the sensor packaging structure 100 in this embodiment includes a ceramic substrate 1, a sensing chip 2 mounted on the ceramic substrate 1, multiple metal lines 3 electrically coupled to the ceramic substrate 1 and the sensing chip 2, an annular support layer 4 formed on the sensing chip 2, a light-transmitting sheet 5 disposed on the annular support layer 4, and a package 6 formed on the ceramic substrate 1, but is not limited thereto.

[0025] It should be noted that although the sensor packaging structure 100 is described in this embodiment as including the above-mentioned components, the sensor packaging structure 100 can also be adjusted and changed according to design requirements. For example, in other embodiments of the present invention not shown, the sensor packaging structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the ceramic substrate 1 by flip-chip bonding. The structure and connection relationship of each component of the sensor packaging structure 100 in this embodiment will be described below.

[0026] In this embodiment, the ceramic substrate 1 is square or rectangular, but the present invention is not limited thereto. The ceramic substrate 1 has a first plate surface 11, a second plate surface 12 located on the opposite side of the first plate surface 11, and an annular side surface 13 connecting the first plate surface 11 and the second plate surface 12.

[0027] Further, the ceramic substrate 1 has a wafer fixing region 111 at approximately the center of the first plate surface 11, and the ceramic substrate 1 has a plurality of bonding pads 112 formed on the first plate surface 11 outside the wafer fixing region 111. In this embodiment, the plurality of bonding pads 112 are arranged in a generally ring shape around the wafer fixing region 111, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the wafer fixing region 111.

[0028] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square). The sensing chip 2 is described below as an image sensing chip, but the present invention is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the ceramic substrate 1 by die-attach adhesive; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a support area 212 surrounding the sensing area 211 (in an annular shape). Both ends of each metal wire 3 are connected to the ceramic substrate 1 and the support area 212 of the sensing chip 2, respectively, so that the ceramic substrate 1 and the sensing chip 2 are electrically coupled to each other through the plurality of metal wires 3.

[0029] More specifically, the sensing chip 2 includes a plurality of connecting pads 213 located in the bearing region 212 (that is, the plurality of connecting pads 213 are located outside the sensing region 211). In this embodiment, the number and position of the plurality of connecting pads 213 of the sensing chip 2 correspond to the number and position of the plurality of bonding pads 112 of the ceramic substrate 1, respectively; that is, in this embodiment, the plurality of connecting pads 213 are also generally arranged in a ring shape.

[0030] Furthermore, one end of each of the plurality of metal wires 3 is connected to a plurality of bonding pads 112, and the other end of each of the plurality of metal wires 3 is connected to a plurality of connecting pads 213 (that is, each of the two ends of each of the metal wires 3 is connected to a bonding pad 112 and a corresponding connecting pad 213). Any of the metal wires 3 may be in a normal bond or a reverse bond configuration according to design requirements, and this invention does not impose any limitation on this.

[0031] The annular support layer 4 is disposed on the carrier region 212 of the sensing chip 2 and surrounds the outer side of the sensing region 211. In this embodiment, each of the connecting pads 213 and the metal wires 3 connected thereto are partially embedded within the annular support layer 4, while the remaining portion of each metal wire 3 is embedded within the package 6, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the annular support layer 4 may be located inside the plurality of metal wires 3 and not in contact with any of the metal wires 3 (that is, each metal wire 3 is located outside the annular support layer 4 and is completely embedded within the package 6).

[0032] In this embodiment, the light-transmitting sheet 5 is described as a flat glass plate, but the present invention is not limited thereto. The light-transmitting sheet 5 is disposed on the annular support layer 4, such that the light-transmitting sheet 5, the annular support layer 4, and the top surface 21 of the sensing chip 2 together form a closed space E, and the sensing area 211 is located within the closed space E. It should be further noted that, in this embodiment, the closed space E is preferably not filled with any colloid, but this is not a limitation.

[0033] The package 6 is formed on the first plate surface 11 of the ceramic substrate 1 and covers the entire annular side surface 13, such that at least a portion of the ceramic substrate 1, the sensing chip 2, the annular support layer 4, the light-transmitting sheet 5, and each of the metal lines 3 are embedded within the package 6. The second plate surface 12 of the ceramic substrate 1 and at least a portion of the outer surface 51 of the light-transmitting sheet 5 are exposed outside the package 6, and the bottom edge 62 of the package 6 is flush with the second plate surface 12 of the ceramic substrate 1.

[0034] It should be noted that the encapsulation body 6 in this embodiment is a cured liquid compound, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the encapsulation body 6 may also be a molding compound.

[0035] As described above, in this embodiment, the sensor packaging structure 100 and its manufacturing method can achieve better protection through the packaging body 6 by adopting an architecture in which the remaining components are embedded in the packaging body 6 (that is, all components of the sensing module M are embedded in the packaging body 6). For example, the annular side 13 of the ceramic substrate 1 can be completely protected by the packaging body 6.

[0036] Furthermore, the carrier of the sensor packaging structure 100 is a ceramic substrate 1 with a small coefficient of thermal expansion, so that the ceramic substrate 1 is not easily warped by the thermal expansion and contraction of the package 6, thereby allowing the ceramic substrate 1 to be embedded within the package 6. In other words, any packaging structure that does not embed a ceramic substrate within the package is different from the sensor packaging structure 100 referred to in this embodiment.

[0037] [Example 2]

[0038] Please refer to Figures 7 to 9, which illustrate Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 1 are roughly explained as follows:

[0039] In the first dispensing step S230 of this embodiment, a partition wall 400 is formed within the barrier wall 300 by dispensing adhesive on the worktable 200, and the partition wall 400 is connected to the barrier wall 300 to jointly form a plurality of partition regions R, and each sensing module M is located within one partition region R. Furthermore, in the second dispensing step S240, the encapsulation layer includes a plurality of encapsulation bodies 6 respectively located within the plurality of partition regions R. In the cutting step S250, the encapsulation layer is cut along the path P of the plurality of sensing modules M without touching any of the sensing modules M, so that the encapsulation layer forms a plurality of encapsulation bodies 6 respectively covering the plurality of sensing modules M. Wherein, each sensing module M and the corresponding encapsulation body 6 are collectively defined as a sensor encapsulation structure 100.

[0040] More specifically, each of the sensing modules M and the boundary of the corresponding separation region R are arranged approximately equidistantly, so that in any of the sensor package structures 100, the two top edge regions 61 of the package body 6 located on opposite sides of the light-transmitting sheet 5 are arranged symmetrically with respect to the light-transmitting sheet 5.

[0041] [Example 3]

[0042] Please refer to Figure 10, which is Embodiment 3 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 1 described above are roughly as follows:

[0043] In this embodiment, the annular side surface 13 of the ceramic substrate 1 is stepped; that is, the annular side surface 13 has a first stepped surface 131 (vertically) connected to the first plate surface 11, a second stepped surface 132 (vertically) connected to the second plate surface 12, and a stepped surface 133 (vertically) connected between the first stepped surface 131 and the second stepped surface 132. The first stepped surface 131, the second stepped surface 132, and the stepped surface 133 are all annular and embedded within the package 6.

[0044] [Technical Effects of the Embodiments of the Invention]

[0045] In summary, the sensor packaging structure and manufacturing method disclosed in the embodiments of the present invention can achieve better protection effect through the packaging body by adopting the architecture of embedding the remaining components in the packaging body (that is, all components of the sensing module are embedded in the packaging body). For example, the ring side of the ceramic substrate can be completely protected by the packaging body.

[0046] Furthermore, the sensor packaging structure and manufacturing method disclosed in the embodiments of the present invention can, by selecting a ceramic substrate with a small coefficient of thermal expansion, make the ceramic substrate less susceptible to warping due to thermal expansion and contraction of the package, thereby enabling the ceramic substrate to be embedded within the package. In other words, any packaging structure that does not embed a ceramic substrate within the package is different from the sensor packaging structure referred to in this embodiment.

[0047] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the patent scope of the present invention. [Simplified Explanation of the Diagram]

[0048] Figure 1 is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of the present invention.

[0049] Figure 2 is a top view of Figure 1.

[0050] Figure 3 is a schematic cross-sectional view along section line III-III of Figure 1.

[0051] Figure 4 is a top view of the sensor packaging structure manufacturing method of Embodiment 1 of the present invention after the first dispensing step.

[0052] Figure 5 is a schematic cross-sectional view along section line VV in Figure 4.

[0053] Figure 6 is a cross-sectional view of the subsequent steps in Figure 4.

[0054] Figure 7 is a top view of the sensor packaging structure manufacturing method of Embodiment 2 of the present invention after the first dispensing step.

[0055] Figure 8 is a cross-sectional view along section line VIII-VIII in Figure 7.

[0056] Figure 9 is a cross-sectional view of the subsequent steps in Figure 8.

[0057] Figure 10 is a cross-sectional schematic diagram of the sensor packaging structure of Embodiment 3 of the present invention.

Claims

1. A method for manufacturing a sensor packaging structure, comprising: A preliminary step: providing multiple sensing modules, and the manufacturing process of each sensing module includes: mounting and electrically coupling a sensing chip to a ceramic substrate; forming an annular support layer on the top surface of the sensing chip; and disposing a light-transmitting sheet on the annular support layer to form a sensing module; a placement step: placing the ceramic substrates of the multiple sensing modules on a worktable; a first dispensing step: dispensing adhesive on the worktable to form a barrier wall that surrounds the multiple sensing modules inside it. A second dispensing step: dispensing adhesive within the barrier wall of the workbench to form an encapsulation layer, in which a plurality of the sensing modules are embedded, and at least a portion of the outer surface of the light-transmitting sheet of each of the sensing modules is exposed outside the encapsulation layer; and a cutting step: cutting the encapsulation layer along the outer side of the plurality of sensing modules without touching any of the sensing modules, so that the encapsulation layer forms a plurality of encapsulations respectively covering the plurality of sensing modules, and each encapsulation covers the entire circumferential side of the ceramic substrate of the corresponding sensing module; wherein each sensing module and the corresponding encapsulation are collectively defined as a sensor encapsulation structure.

2. The method for manufacturing the sensor packaging structure as described in claim 1, wherein, In any of the sensor package structures, the two top edge regions of the package located on opposite sides of the light-transmitting sheet are arranged asymmetrically with respect to the light-transmitting sheet.

3. The method for manufacturing the sensor packaging structure as described in claim 1, wherein, In the first dispensing step, a partition wall is formed by dispensing adhesive on the workbench, located within the barrier wall, and the partition wall is connected to the barrier wall to jointly form multiple partition areas, with each sensing module located within one of the partition areas; wherein, in the second dispensing step, the encapsulation layer includes multiple encapsulation bodies respectively located within the multiple partition areas.

4. The method for manufacturing the sensor packaging structure as described in claim 3, wherein, In any of the sensor package structures, the two top edge regions of the package body located on opposite sides of the light-transmitting sheet are arranged symmetrically with respect to the light-transmitting sheet.

5. The method for manufacturing the sensor packaging structure as described in claim 1, wherein, The manufacturing process of each of the sensing modules further includes: after the sensing chip is mounted on the ceramic substrate, connecting the ceramic substrate and the sensing chip with multiple metal wires, so that the ceramic substrate and the sensing chip are electrically coupled to each other through the multiple metal wires.

6. A sensor packaging structure, comprising: A ceramic substrate has a first surface, a second surface opposite to the first surface, and an annular side surface connected between the first surface and the second surface; a sensing chip mounted on the first surface of the ceramic substrate and electrically coupled to the ceramic substrate; wherein the top surface of the sensing chip includes a sensing region and a support region surrounding the sensing region; an annular support layer formed on the support region of the sensing chip; a light-transmitting sheet disposed on the annular support layer; wherein the light-transmitting sheet, the annular support layer, and the top surface of the sensing chip together form a closed space, and the sensing region is located within the closed space; and a package formed on the first surface of the ceramic substrate and covering the entire annular side surface, such that the ceramic substrate, the sensing chip, the annular support layer, and the light-transmitting sheet are embedded within the package; wherein at least a portion of the outer surface of the second surface of the ceramic substrate and the light-transmitting sheet are exposed outside the package, and the bottom edge of the package is flush with the second surface of the ceramic substrate.

7. The sensor packaging structure as described in claim 6, wherein, The annular side surface of the ceramic substrate has a first step surface connected to the first plate surface, a second step surface connected to the second plate surface, and a step surface connected between the first step surface and the second step surface, and the first step surface, the second step surface, and the step surface are all embedded within the package.

8. The sensor packaging structure as described in claim 7, wherein, The first trapezoidal surface, the second trapezoidal surface, and the step surface are all annular, and the step surface is perpendicularly connected to the first trapezoidal surface and the second trapezoidal surface.

9. The sensor packaging structure as described in claim 6, wherein, The sensor package structure includes multiple metal lines connecting the ceramic substrate and the sensor chip, and the ceramic substrate and the sensor chip are electrically coupled to each other through the multiple metal lines, with at least a portion of each metal line embedded within the package.

10. The sensor packaging structure as described in claim 9, wherein, The ceramic substrate includes a plurality of bonding pads located on the first plate surface, and the sensing chip is located inside the plurality of bonding pads. The top of the sensing chip includes a plurality of connecting pads located in the bearing area, and the plurality of connecting pads are embedded within the annular support layer. One end of a plurality of metal wires is connected to a plurality of bonding pads, and the other end of a plurality of metal wires is connected to a plurality of connecting pads and embedded within the annular support layer.

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