Sensor package structure

Abstract

The present invention provides a sensor package structure, which includes a substrate, a sensor chip mounted on the substrate, a plurality of metal wires connected to the substrate and the sensor chip, a molding compound formed on the substrate and surrounding the sensor chip and the metal wires, a ring-shaped supporting layer formed on a flat top surface of the molding compound, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulating adhesive that is formed on a slanting surface of the molding compound in a dispensing manner. The slanting surface and the substrate have an angle therebetween that is less than

Description

[Technical Field]

[0001] This invention relates to a packaging structure, and more particularly to a sensor packaging structure employing two types of packages. [Previous Technology]

[0002] Existing sensor packaging structures that simultaneously employ molded and liquid encapsulated bodies often suffer from difficulty in removing air bubbles generated within the liquid encapsulated body, leading to reduced yield. Therefore, the inventors believe that these defects can be improved and propose an invention with a reasonable design that effectively addresses these defects. [Summary of the Invention]

[0003] The present invention provides a sensor packaging structure that can effectively improve the defects that may occur in existing sensor packaging structures.

[0004] This invention discloses a sensor packaging structure, comprising: a substrate having a first plate surface, a second plate surface located opposite to the first plate surface, and an annular side surface connected between the first plate surface and the second plate surface; a sensor chip mounted on the first plate surface of the substrate, wherein the top of the sensor chip includes a sensing area and a carrying area surrounding the sensing area; a plurality of metal wires connecting the substrate and the carrying area of ​​the sensor chip to electrically couple the substrate and the sensor chip to each other; a molded package formed on the first plate surface of the substrate, wherein the molded package surrounds the sensor chip and the plurality of metal wires on the outside; wherein the molded package has: an inner edge facing the sensor chip and the plurality of metal wires, and the molded package forming an inner angle of less than 90 degrees between the inner edge and the first plate surface; and an outer edge located opposite to the inner edge and coplanar with the first plate surface of the substrate. The molded package comprises: a ring-shaped side surface; a top plane connected to the inner edge and parallel to the first plate surface; a dispensing ramp connected between the top plane and the outer edge, wherein the molded package forms an outer angle of less than 90 degrees between the dispensing ramp and the first plate surface; an annular support layer formed on the top plane of the molded package; a light-transmitting sheet disposed on the annular support layer; wherein the light-transmitting sheet, the annular support layer, the molded package, and the first plate surface of the substrate together surround and form a closed space; wherein the sensing chip and the plurality of metal lines are located within the closed space; and an encapsulating colloid formed on the dispensing ramp of the molded package by dispensing, wherein the encapsulating colloid is annular and covers the outer side of the annular support layer and the outer side of the light-transmitting sheet; wherein the encapsulating colloid has an inclined top edge and an annular side edge connected to the top edge, and the annular side edge of the encapsulating colloid is coplanar with the outer edge of the molded package.

[0005] In summary, the sensor packaging structure disclosed in the embodiments of the present invention uses a packaging colloid formed by dispensing to be combined with the structure of the molded package (e.g., the dispensing slope) so that the formation of air bubbles is not favorable within the packaging colloid, and any air bubbles that may appear within the packaging colloid will float upward and be discharged during the dispensing process, thereby improving the yield of the sensor packaging structure.

[0006] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention in any way.

Implementation Method

[0007] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this invention are only simple illustrations and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0008] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. In addition, the term "or" as used herein may, as appropriate, include any combination of one or more of the associated listed items.

[0009] [Example 1]

[0010] Please refer to Figures 1 to 6, which are embodiments of the present invention. This embodiment discloses a sensor packaging structure 100, which includes a substrate 1, a sensing chip 2 disposed on one side of the substrate 1, a plurality of metal lines 3 connecting the sensing chip 2 and the substrate 1, a molding compound 4 formed on the substrate 1 and surrounding the sensing chip 2 and the plurality of metal lines 3, an annular support layer 5 formed on the molding compound 4, a light-transmitting sheet 6 fixed to the annular support layer 5, and an encapsulating adhesive 7 covering the sides of the annular support layer 5 and the light-transmitting sheet 6.

[0011] The substrate 1 in this embodiment is square or rectangular, but the present invention is not limited thereto. In this embodiment, the substrate 1 includes a first plate surface 11, a second plate surface 12 located on the opposite side of the first plate surface 11, and an annular side surface 13 connecting the first plate surface 11 and the second plate surface 12. The first plate surface 11 has a wafer fixing region 111 located approximately at its center, and a plurality of bonding pads 112 located outside the wafer fixing region 111. In this embodiment, the plurality of bonding pads 112 are generally arranged in a ring and surround the wafer fixing region 111, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the plurality of bonding pads 112 may also be arranged in two rows on opposite sides of the wafer fixing region 111.

[0012] In this embodiment, the sensing chip 2 is square (e.g., rectangular or square). The sensing chip 2 is described below as an image sensing chip, but the present invention is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1 by die-attach adhesive; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a support area 212 surrounding the sensing area 211 (in an annular shape). Both ends of each metal wire 3 are connected to the substrate 1 and the support area 212 of the sensing chip 2, respectively, so that the substrate 1 and the sensing chip 2 are electrically coupled to each other through the plurality of metal wires 3.

[0013] More specifically, the sensing chip 2 includes a plurality of connecting pads 213 located in the bearing region 212 (that is, the plurality of connecting pads 213 are located outside the sensing region 211). In this embodiment, the number and position of the plurality of connecting pads 213 of the sensing chip 2 correspond to the number and position of the plurality of bonding pads 112 of the substrate 1, respectively; that is, in this embodiment, the plurality of connecting pads 213 are also generally arranged in a ring shape.

[0014] Furthermore, one end of each of the plurality of metal wires 3 is connected to a plurality of bonding pads 112, and the other end of each of the plurality of metal wires 3 is connected to a plurality of connecting pads 213 (that is, each of the two ends of each of the metal wires 3 is connected to a bonding pad 112 and a corresponding connecting pad 213). Any of the metal wires 3 may be in a normal bond or a reverse bond configuration according to design requirements, and this invention does not impose any limitation on this.

[0015] The molded package 4 is formed on the first surface 11 of the substrate 1, and the molded package 4 surrounds the outer side of the sensing chip 2 and the plurality of metal lines 3. The outer surface of the molded package 4 has an inner edge 41, an outer edge 42 located opposite to the inner edge 41, a top plane 43 connected to the inner edge 41, and a small adhesive bevel 44 connecting the top plane 43 and the outer edge 42.

[0016] More specifically, the inner edge 41 of the molded package 4 is annular and faces the sensing chip 2 and the plurality of metal lines 3, and the inner edge 41 does not touch any of the metal lines 3. The molded package 4 forms an inner angle σ41 of less than 90 degrees between the inner edge 41 and the first plate surface 11, and the inner angle σ41 in this embodiment can be between 30 degrees and 80 degrees (e.g., 45 degrees to 60 degrees) to facilitate the demolding operation of the molded package 4, but the present invention is not limited thereto.

[0017] The outer edge 42 of the molded package 4 is annular and coplanar with the annular side surface 13 of the substrate 1. That is, the angle between the outer edge 42 of the molded package 4 and the first plate surface 11 is 90 degrees, and any package that fails to meet the above conditions is not the molded package 4 referred to in this embodiment.

[0018] The top plane 43 of the molded package 4 is annular and preferably parallel to the first plate surface 11, and the height of the top plane 43 relative to the first plate surface 11 is greater than the height of any of the metal lines 3 relative to the first plate surface 11.

[0019] The molded package 4 forms an angle greater than 90 degrees and less than 180 degrees between the dispensing inclined surface 44 and the top plane 43, and an external angle σ44 less than 90 degrees between the dispensing inclined surface 44 and the first plate surface 11. In this embodiment, the external angle σ44 can be between 30 degrees and 80 degrees (e.g., 45 degrees to 60 degrees), and the difference between the internal angle σ41 and the external angle σ44 is preferably no greater than 10 degrees, thereby facilitating the demolding operation of the molded package 4, but the present invention is not limited thereto.

[0020] The annular support layer 5 is formed on the top plane 43 of the molded package 4, and the light-transmitting sheet 6 is disposed on the annular support layer 5. In this embodiment, the light-transmitting sheet 6 is described as a transparent flat glass plate, but the present invention is not limited thereto.

[0021] Further, the light-transmitting sheet 6, the annular support layer 5, the molded package 4, and the first plate surface 11 of the substrate 1 together form a closed space E. The sensing chip 2 and the plurality of metal lines 3 are located within the closed space E. Furthermore, the outer side of the light-transmitting sheet 6, the annular support layer 5, and the top plane 43 of the molded package 4 also together form an annular groove S, but the present invention is not limited thereto.

[0022] The encapsulating compound 7 is, for example, a liquid compound, which is formed by dispensing onto the dispensing ramp 44 of the molded encapsulation body 4, and the annular groove S is filled by the encapsulating compound 7. That is, in this embodiment, the encapsulating compound 7 is formed by sequentially stacking multiple adhesive layers 7a from the dispensing ramp 44, and the annular groove S is filled by at least two adhesive layers 7a located on the dispensing ramp 44.

[0023] In other words, the encapsulating colloid 7 includes a first bonding segment 71, a second bonding segment 72 stacked on the first bonding segment 71, and a third bonding segment 73 stacked on the second bonding segment 72. Each of the first bonding segment 71, the second bonding segment 72, and the third bonding segment 73 may be composed of at least one adhesive layer 7a. Furthermore, the first bonding segment 71 is bonded to the dispensing slope 44 and is substantially coplanar with the top plane 43; the second bonding segment 72 is bonded to the wall of the annular groove S; and the third bonding segment 73 is bonded to the light-transmitting sheet 6 and does not protrude from the light-transmitting sheet 6.

[0024] The encapsulating colloid 7 is annular and covers the outer side of the annular support layer 5 and the outer side of the light-transmitting sheet 6, and a portion of each metal wire 3 may be located within the space surrounded by the encapsulating colloid 7. The encapsulating colloid 7 has an inclined top edge 731 and an annular side edge 74 connected to the top edge 731, and the top edge 731 of the encapsulating colloid 7 is located in the third joint section 73.

[0025] Furthermore, the annular side edge 74 of the encapsulating colloid 7 is jointly formed by the first joining segment 71, the second joining segment 72, and the third joining segment 73, and the annular side edge 74 of the encapsulating colloid 7 is coplanar with the outer edge 42 of the molded package 4 and the annular side surface 13 of the substrate 1. Furthermore, the height H74 of the annular side edge 74 of the encapsulating colloid 7 relative to the first plate surface 11 is greater than the height H5 of the annular support layer 5 relative to the first plate surface 11, but the present invention is not limited thereto.

[0026] It should be further noted that, in this embodiment, the encapsulating colloid 7 is constructed by dispensing in conjunction with the molded encapsulation body 4 (e.g., the dispensing slope 44) to prevent the formation of air bubbles within the encapsulating colloid 7. Furthermore, any air bubbles that may appear within the encapsulating colloid 7 will float upwards and be expelled during the dispensing process, thus preventing the formation of any air bubbles within the encapsulating colloid 7. Moreover, the angle design of the dispensing slope 44 between the encapsulating colloid 7 and the molded encapsulation body 4 (e.g., the outer included angle σ44) makes it difficult for moisture to climb along the dispensing slope 44 into the enclosed space E.

[0027] [Example 2]

[0028] Please refer to Figure 7, which is Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment 1 described above are roughly as follows:

[0029] In this embodiment, the annular support layer 5 may be constructed to protrude from the light-transmitting sheet 6 according to actual needs, so that the light-transmitting sheet 6, the outer side of the annular support layer 5, and the top plane 43 of the molded package 4 do not surround the annular groove as described in Embodiment 1.

[0030] [Technical Effects of the Embodiments of the Invention]

[0031] In summary, the sensor packaging structure disclosed in the embodiments of the present invention uses a packaging colloid formed by dispensing to be combined with the structure of the molded package (e.g., the dispensing slope) so that the formation of air bubbles is not favorable within the packaging colloid, and any air bubbles that may appear within the packaging colloid will float upward and be discharged during the dispensing process, thereby improving the yield of the sensor packaging structure (e.g., no air bubbles are formed within the packaging colloid).

[0032] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the patent scope of the present invention. [Simplified Explanation of the Diagram]

[0033] Figure 1 is a three-dimensional schematic diagram of the sensor packaging structure of Embodiment 1 of the present invention.

[0034] Figure 2 is a top view of Figure 1.

[0035] Figure 3 is a schematic cross-sectional view along section line III-III of Figure 1.

[0036] Figure 4 is an enlarged schematic diagram of region IV in Figure 3.

[0037] Figure 5 is a schematic diagram of the forming process of Figure 4 (I).

[0038] Figure 6 is a schematic diagram of the forming process of Figure 4 (II).

[0039] Figure 7 is a three-dimensional schematic diagram of the sensor packaging structure of Embodiment 2 of the present invention.

Claims

1. A sensor packaging structure, comprising: A substrate has a first plate surface, a second plate surface located on the opposite side of the first plate surface, and an annular side surface connected between the first plate surface and the second plate surface; A sensing chip is mounted on the first surface of the substrate, and the top of the sensing chip includes a sensing area and a carrying area surrounding the sensing area. Multiple metal lines connect the substrate and the carrier area of ​​the sensing chip to electrically couple the substrate and the sensing chip to each other; a molded package is formed on the first surface of the substrate, and the molded package surrounds the sensing chip and the multiple metal lines; wherein the molded package has: an inner edge facing the sensing chip and the multiple metal lines, and the molded package forms an inner angle of less than 90 degrees between the inner edge and the first surface; an outer edge located on the opposite side of the inner edge and coplanar with the annular side surface of the substrate; a top plane connected to the inner edge and parallel to the first surface; and a dispensing bevel connected between the top plane and the outer edge, and the molded package forms an outer angle of less than 90 degrees between the dispensing bevel and the first surface; and an annular support layer formed on the top plane of the molded package. A light-transmitting sheet is disposed on the annular support layer; wherein the light-transmitting sheet, the annular support layer, the molded package, and the first plate surface of the substrate together surround and form a closed space; wherein the sensing chip and multiple metal lines are located within the closed space; and an encapsulating colloid is formed on the dispensing slope of the molded package by dispensing, and the encapsulating colloid is annular and covers the outer side of the annular support layer and the outer side of the light-transmitting sheet; wherein the encapsulating colloid has an inclined top edge and an annular side edge connected to the top edge, and the annular side edge of the encapsulating colloid is coplanar with the outer edge of the molded package.

2. The sensor packaging structure as described in claim 1, wherein, The light-transmitting sheet, the outer side of the annular support layer, and the top plane of the molded package together form an annular groove, and the annular groove is filled by the encapsulating colloid.

3. The sensor packaging structure as described in claim 2, wherein, The encapsulating colloid is formed by sequentially stacking multiple adhesive layers from the dispensing ramp, and the annular groove is filled by at least two of the adhesive layers located above the dispensing ramp.

4. The sensor packaging structure as described in claim 2, wherein, The encapsulating colloid comprises: a first bonding segment bonded to the dispensing slope; a second bonding segment stacked on the first bonding segment and bonded to the wall of the annular groove; and a third bonding segment stacked on the second bonding segment and bonded to the light-transmitting sheet, wherein the top edge of the encapsulating colloid is located at the third bonding segment.

5. The sensor packaging structure as described in claim 1, wherein, Each of the metal wires is partially located within the space surrounded by the encapsulating colloid.

6. The sensor packaging structure as described in claim 1, wherein, The height of the annular side edge of the encapsulating colloid relative to the first plate surface is greater than the height of the annular support layer relative to the first plate surface.

7. The sensor packaging structure as described in claim 1, wherein, The included inner angle and the included outer angle are both between 30 degrees and 80 degrees.

8. The sensor packaging structure as described in claim 7, wherein, The difference between the included inner angle and the included outer angle is no greater than 10 degrees.

9. The sensor packaging structure as described in claim 1, wherein, No air bubbles were formed inside the encapsulating colloid.

10. The sensor packaging structure as described in claim 1, wherein, The annular support layer protrudes from the light-transmitting sheet.

Images