Methods of bonding a semiconductor element to a substrate

Abstract

A method of bonding a semiconductor element to a substrate is provided. The method includes the steps of: (a) carrying the semiconductor element with a bonding tool, the semiconductor element including a first plurality of conductive structures; (b) supporting the substrate with a support structure, the substrate including a second plurality of conductive structures; (c) heating at least one of the first plurality of conductive structures and the second plurality of conductive structures such that at least one of (i) the first plurality of conductive structures and (ii) the second plurality of conductive structures expands; (d) bonding the first plurality of conductive structures to corresponding ones of the second plurality of conductive structures; and (e) bonding a dielectric surface of the semiconductor element to a dielectric surface of the substrate after step (d).

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