Hybrid bonding-based micro-led chip and method for forming the same

Abstract

The present disclosure relates to a hybrid bonding-based micro-LED chip, including: an upper stacked layer, which includes: a first insulating layer configured to accommodate a light-emitting mesa and a first through-hole contact portion; a light-emitting mesa configured to emit light, wherein the top surface area of the light-emitting mesa is greater than the bottom surface area of the light-emitting mesa; and a first through-hole contact portion electrically connected with the bottom of the light-emitting mesa and passing through the first insulating layer; and a lower stacked layer, which includes: a second insulating layer configured to accommodate a second through-hole contact portion; a second through-hole contact portion passing through the second insulating layer; and a drive backplane electrically connected with the second through-hole contact portion, wherein the lower stacked layer is bonded with the upper stacked layer through hybrid bonding, such that the first through-hole contact portion is bonded with the second through-hole contact portion and the first insulating layer is bonded with the second insulating layer.

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