Laser processing equipment for SiC ingots

Abstract

This disclosure relates to a laser processing apparatus for SiC ingots, which includes a workpiece stage, a focusing objective lens, a moving unit, a Raman information acquisition unit, a focusing height acquisition unit, a laser processing unit, and a control unit. The workpiece stage and the focusing objective lens are respectively disposed at the moving end of the moving unit. The moving path of the focusing objective lens passes through the projection optical paths of the Raman information acquisition unit, the focusing height acquisition unit, and the laser processing unit. The moving unit, the Raman information acquisition unit, the focusing height acquisition unit, and the laser processing unit are respectively connected to the control unit to achieve focusing of the projected light rays through the focusing objective lens on the workpiece surface layer and the modified layer on the workpiece stage.

Images