Method for polishing outer circumferential part of wafer and polishing device for outer circumferential part of wafer

Abstract

The purpose of the present invention is to provide a method for polishing the outer circumferential part of a wafer to prevent deterioration of flatness of the wafer outer circumferential part and occurrence of chipping. One solution is a method for a polishing method for wafer outer circumferential part, wherein, among said outer circumferential part of the wafer, there is an inclined surface that is continuous with, and inclined with respect to, the main surface of the wafer. Said inclined surface is polished while the wafer is being rotated. The method comprises a first polishing step and a second polishing step. In the first polishing step, the inclined surface is polished by pressing a first polishing surface against the inclined surface. The first polishing surface intersects the main surface at a first angle. In the second polishing step, the inclined surface is polished by pressing a second polishing surface against the inclined surface. The second polishing surface intersects the main surface at a second angle. The second angle is smaller than the first angle.

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