Resin material supply mechanism, resin molding device, and manufacturing method for resin molded products
TW202633761APending Publication Date: 2026-08-16TOWA
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Patent Information
- Application Number
- TW114138978
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-04
- Filing Date
- 2025-10-09
- Publication Date
- 2026-08-16
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Abstract
A resin material supply mechanism that uses a planar member to supply resin material to a cavity includes: an inner frame portion (61) having a through hole (63) extending vertically, and forming a space for the resin material to be injected by the through hole (63) and the planar member by abutting against the planar member; an outer frame portion (62) that can be raised and lowered on its inner side to support the inner frame portion; and a dust suppression portion (70) for suppressing dust from entering the gap between the inner frame portion (61) and the outer frame portion (62).
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