Resin material supply mechanism, resin molding device, and manufacturing method for resin molded products

TW202633761APending Publication Date: 2026-08-16TOWA
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Patent Information

Application Number
TW114138978
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-04
Filing Date
2025-10-09
Publication Date
2026-08-16

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Abstract

A resin material supply mechanism that uses a planar member to supply resin material to a cavity includes: an inner frame portion (61) having a through hole (63) extending vertically, and forming a space for the resin material to be injected by the through hole (63) and the planar member by abutting against the planar member; an outer frame portion (62) that can be raised and lowered on its inner side to support the inner frame portion; and a dust suppression portion (70) for suppressing dust from entering the gap between the inner frame portion (61) and the outer frame portion (62).
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