conductive adhesive

Abstract

The conductive paste of the present invention comprises conductive powder with copper as the main component, glass glue, binding resin and organic solvent. Its characteristics are as follows: the glass glue substantially does not contain Zn, and, based on the mass percentage converted from oxides, contains 40.0% to 65.0% BaO, 15.0% to 23.0% B2O3, 2.0% to 12.0% Al2O3, 4.0% to 8.0% SiO2, 3.0% to 7.5% CaO, 2.5% to 5.0% MnO2, and 10.0% to 14.0% CuO; the total content of MnO2 and CuO in the glass glue is 12.5% ​​to 17.5%, and the mass ratio of CuO to MnO2 in the glass glue is 2.0 to 4.0. By using this conductive paste, electronic components with highly dense terminal electrodes and excellent flexural strength can be manufactured.

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