Methods for forming polymer, photosensitive resin composition, photosensitive element, resist pattern, and wiring pattern.

Abstract

A polymer is disclosed comprising a structural unit represented by the following formula (I) and a structural unit having a carboxyl group. A photosensitive resin composition is also disclosed, comprising: an adhesive resin containing the polymer, a photopolymerizable compound, and a photopolymerization initiator. In formula (I), R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl, aryl, aralkyl, or hydrogen atom.

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