Curable resin compositions, prepregs, and their cured forms

Abstract

This invention provides a curable resin composition with high heat resistance and excellent decomposability at high temperatures. The curable resin composition contains an epoxy resin (A) represented by formula (1) and a phenolic resin (B) represented by formula (2), wherein, in 13C-NMR analysis, the proportion of aromatic carbon atoms in the integral values ​​of all carbon atoms contained in the epoxy resin (A) and the phenolic resin (B) is 30% or more and 60% or less. (In formulas (1) to (2), multiple R1s independently represent alkyl groups with 1 to 5 carbons or aromatic groups with 1 to 20 carbons that may have substituents; multiple R2s independently represent alkyl groups with 1 to 5 carbons or aromatic groups with 1 to 20 carbons that may have substituents; multiple p1s independently represent integers from 0 to 3; multiple p2s independently represent integers from 0 to 3; G represents a substituted or unsubstituted glycidyl group; multiple r1s independently represent 1 or 2; multiple r2s independently represent 1 or 2; multiple Xs independently represent hydrocarbon groups with 1 to 20 carbons that may have substituents; multiple Ys independently represent hydrocarbon groups with 1 to 20 carbons that may have substituents; n1 and n2 are the average of the number of repetitions, 1 < n1 < 5, 1 < n2 < 5)

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