Curable resin composition, its cured products, and methods for manufacturing the cured products.

Abstract

This invention provides: a curable resin composition capable of forming a cured product using a common resin, exhibiting excellent compatibility and low dielectric loss tangent; a method for manufacturing the cured product; a method for manufacturing a printed circuit board using the cured product; and a method for manufacturing an antenna component using the cured product. This invention relates to a curable resin composition comprising a styrene-based thermoplastic elastomer, a crosslinking agent, and a polymerization initiator. The polymerization initiator does not have a group represented by -C(=O)-OO- or -CN. The ratio of structural units derived from styrene monomers in the styrene-based thermoplastic elastomer to 100 mol% of the total structural units is 40 mol% or more. The content of the polymerization initiator to 100 parts by weight of the total styrene-based thermoplastic elastomer is less than 2 parts by weight. none