Resin composition, cured material, transfer film, laminate, manufacturing method of cured material, manufacturing method of laminate, manufacturing method of semiconductor device, semiconductor device and resin

Abstract

This invention provides a resin composition that can produce a cured material with improved glass transfer temperature and excellent elongation at break. This invention provides a resin composition, a cured material obtained by curing the above-mentioned resin composition, a transfer film containing the above-mentioned resin composition, a laminate containing the above-mentioned cured material, a method for manufacturing the above-mentioned cured material, a method for manufacturing the above-mentioned laminate, a method for manufacturing a semiconductor device including the method for manufacturing the above-mentioned cured material, a semiconductor device containing the above-mentioned cured material, and a resin. The resin composition comprises: (A) a resin having a structure represented by formula (A-1) or formula (A-2) as described in the specification; and (B) a polymerization initiator.