Polyimide film, metal-clad laminate and circuit

Abstract

This invention provides a polyamide, a polyimide, a polyimide film, a metal-clad laminate, and a circuit board, which have the low thermal expansion, low moisture absorption, and good film-forming properties required for FPC materials, and a sufficiently low dielectric loss tangent. A polyamide or polyimide contains dianhydride residues derived from an acid dianhydride component and diamine residues derived from a diamine component, and satisfies condition (i): containing 25 mol% or more of dianhydride residues derived from the acid dianhydride represented by the following formula (1) relative to all acid dianhydride residues; condition (ii): containing 50 mol% or more of diamine residues derived from a diamine compound represented by the following general formula (2) relative to all diamine residues; condition (iii): the proportion of monomer residues having a biphenyl backbone is 65 mol% or more relative to all monomer residues derived from all monomer components.