Electronic component manufacturing method and electronic component processing equipment
TW202633993APending Publication Date: 2026-08-16LINTEC CORP
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Patent Information
- Application Number
- TW114140601
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-24
- Filing Date
- 2025-10-21
- Publication Date
- 2026-08-16
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Abstract
This invention reduces the workload of electronic component manufacturing operations. The object to be bonded is attached to an adhesive sheet larger than the object. While fixing the outer periphery of the adhesive sheet, the object attached to the adhesive sheet is thinned. The individual bonded objects are selectively picked up from the adhesive sheet.
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