resin composition

TW202633994APending Publication Date: 2026-08-16KURARAY CO LTD
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Patent Information

Application Number
TW114140094
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-28
Filing Date
2025-10-17
Publication Date
2026-08-16
Patent Text Reader

Abstract

A resin composition comprising a block copolymer (I), a block copolymer (II), and an adhesive resin (X), wherein (I) comprises a polymer block (A1) containing α-methylstyrene units and a polymer block (B1) containing conjugated diene compound units, wherein (A1) and (B1) are triblock copolymers having sequentially bonded block structures, and (II) comprises a polymer block (A2) containing α-methylstyrene units and a polymer block (B2) containing conjugated diene compound units, wherein (A2) and (B2) are copolymers having sequentially bonded block structures, wherein the resin composition contains (I) and (II) in a predetermined mass ratio, and wherein (I) and (II) are hydrogenated block copolymers with a predetermined hydrogenation rate.
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