Epoxy resin composition and semiconductor device encapsulated using the same
TW202633997APending Publication Date: 2026-08-16SAMSUNG SDI CO LTD
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Patent Information
- Application Number
- TW114152110
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-11
- Filing Date
- 2025-12-31
- Publication Date
- 2026-08-16
Abstract
An epoxy resin composition for encapsulation of semiconductor devices, and a semiconductor device encapsulated using the epoxy resin composition. The epoxy resin composition includes an epoxy resin, a curing agent, inorganic fillers, and a curing catalyst.
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