Curable resin composition, dry film, cured material and printed circuit board

Abstract

This invention provides a curable resin composition containing polyphenylene ether resin, which can simultaneously achieve excellent storage stability, excellent adhesion between the cured product and the conductor layer at high temperatures, and excellent dielectric properties of the cured product. In the curable resin composition containing polyphenylene ether resin, styrene-based elastomer resin, and a polymerization initiator, a styrene-based elastomer resin is used. This styrene-based elastomer resin has soft blocks, which are composed of styrene and one or more monomers other than styrene. The melt flow rate of the styrene-based elastomer resin is adjusted to 15.0 g / 10 min or less; and the styrene ratio of the styrene-based elastomer resin is adjusted to 65% by mass or more.