Resin composition, molded body, aggregate, and method for manufacturing the molded body

TW202634003APending Publication Date: 2026-08-16MITSUBISHI GAS CHEM CO INC
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Patent Information

Application Number
TW114141636
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-05
Filing Date
2025-10-28
Publication Date
2026-08-16
Patent Text Reader

Abstract

A resin composition comprising: a polyamide containing a phenylenediamine unit and an α,ω-linear aliphatic dicarboxylic acid unit having 11 to 14 carbon atoms; a compound selected from at least one of the groups consisting of polysiloxane resin, fluorinated compounds, two-dimensional layered substances and high molecular weight polyethylene; a molded body formed from the resin composition; an assembly of the molded bodies; and a method for manufacturing the molded body using the resin composition.
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