Polyimide resin composition and method for producing polyimide film

TW202634004APending Publication Date: 2026-08-16MITSUBISHI GAS CHEM CO INC
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Patent Information

Application Number
TW114138477
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-25
Filing Date
2025-10-07
Publication Date
2026-08-16
Patent Text Reader

Abstract

This invention relates to a polyimide resin composition comprising a polyimide resin and a solvent. The polyimide resin has a constituent unit A derived from tetracarboxylic dianhydride and a constituent unit B derived from a diamine. Constituent unit A comprises 50 mol% or more of a constituent unit (A1) derived from 1,2,4,5-cyclohexanetetracarboxylic dianhydride (a1), and constituent unit B comprises 30 mol% or more of a constituent unit (B1) derived from a compound represented by formula (b1). The polyimide resin composition comprises a polysiloxane-containing acrylic polymer and an acidic phosphate ester. The content of the polysiloxane-containing acrylic polymer is 120 to 1100 ppm by mass relative to the polyimide resin. A polyimide resin composition comprising a polyimide resin and a solvent, wherein the polyimide resin comprises a structural unit (A) derived from a tetracarboxylic dianhydride and a structural unit (B) derived from a diamine, wherein the structural unit (A) contains 50 mol% or more of a structural unit (A1) derived from 1,2,4,5-cyclohexanetetracarboxylic dianhydride (a1), and the structural unit (B) contains 30 mol% or more of a structural unit (B1) derived from a compound represented by formula (b1) below, and wherein the polyimide resin composition includes a silicone-containing acrylic polymer and an acidic phosphate ester, the content of the silicone-containing acrylic polymer being 120 to 1100 mass ppm relative to said polyimide resin.
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