Polishing slurry, polishing method, manufacturing method of components and manufacturing method of semiconductor components

Abstract

A polishing slurry for polishing a workpiece, the polishing slurry containing abrasive grains comprising cerium oxide, and the workpiece containing resin and particles comprising a silicon compound. A polishing method using the polishing slurry to polish a workpiece containing resin and particles comprising a silicon compound. A method for manufacturing a component, using a workpiece polished by the polishing method to obtain a component. A method for manufacturing a semiconductor component, using a workpiece polished by the aforementioned polishing method to obtain a semiconductor component.

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