Conductive adhesive, anisotropic conductive film, connection structure body and method for manufacturing connection structure body

Abstract

This invention provides a conductive adhesive that achieves good solder wettability and conductivity. Furthermore, this invention provides an anisotropic conductive film, a connecting structure, and a method for manufacturing the connecting structure, all achieving good solder wettability, conductivity, and insulation. The anisotropic conductive film contains a thermosetting adhesive, solder particles, and dicarboxylic acid. The solder particles contain 50-80 wt% Sn and 20-50 wt% Bi. The amount of dicarboxylic acid incorporated is 1-15 parts by weight relative to 100 parts by weight of the thermosetting adhesive. The amount of solder particles with an average particle size of 40-5 μm incorporated is 100-1200 parts by weight relative to 100 parts by weight of the thermosetting adhesive. The thickness of the anisotropic conductive film exceeds 110% and is less than 700% of the average particle size of the solder particles. This achieves good solder wettability, conductivity, and insulation. none

Images