Adhesive tape, electrical connection components and structures
TW202634030APending Publication Date: 2026-08-16SEKISUI CHEMICAL CO LTD
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Patent Information
- Application Number
- TW114137508
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-30
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-16
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Abstract
The present invention aims to provide an adhesive tape that combines excellent heat resistance and excellent adhesion to rigid bodies. Furthermore, the present invention aims to provide an electrical connection member that can firmly hold a conductive member in a connected component, maintaining this firm hold even at high temperatures, and providing stable electrical connections at both room and high temperatures. Moreover, the present invention aims to provide a structure that provides stable electrical connections at both room and high temperatures. The present invention is an adhesive tape having an adhesive layer formed using an adhesive composition containing an acrylic copolymer. This acrylic copolymer has constituent units derived from alkyl (meth)acrylates and constituent units derived from olefin polymers with terminal polymerizable unsaturated double bonds. The adhesive layer has grooves on at least one surface. none
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