Light-curing adhesive composition, laminate, adhesive tape, and method for manufacturing adhesive tape

TW202634031APending Publication Date: 2026-08-16SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
TW114137509
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-30
Filing Date
2025-09-30
Publication Date
2026-08-16
Patent Text Reader

Abstract

The object of this invention is to provide a light-curing adhesive composition that can reduce environmental or health impacts and has excellent coatability or printability, adhesion, and retention. Furthermore, the object of this invention is to provide a laminate and adhesive tape made using the light-curing adhesive composition, and a method for manufacturing the adhesive tape using the light-curing adhesive composition. This invention relates to a photocurable adhesive composition comprising a polymerizable monomer, a photopolymerization initiator, and a thermoplastic resin. The polymerizable monomer comprises at least one monofunctional (meth)acrylic acid monomer selected from (hexyl)methacrylate, (heptyl)methacrylate, and (1-methylheptyl)methacrylate. The content of at least one monofunctional (meth)acrylic acid monomer selected from (hexyl)methacrylate, (heptyl)methacrylate, and (1-methylheptyl)methacrylate in 100 parts by mass of the polymerizable monomer is 68 parts by mass or more. The photocurable adhesive composition is solvent-free, or the solvent content is more than 0% by mass and less than 1% by mass. none
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