Semiconductor film adhesives, and semiconductor devices and manufacturing methods thereof
TW202634034APending Publication Date: 2026-08-16RESONAC CORP
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Patent Information
- Application Number
- TW114147540
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-04
- Filing Date
- 2025-12-04
- Publication Date
- 2026-08-16
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Abstract
A semiconductor film adhesive is disclosed, comprising a thermosetting resin, a curing agent, a thermoplastic resin, and an alumina filler surface-treated with a phenylsilane coupling agent. Based on the total amount of the semiconductor film adhesive, the content of the alumina filler surface-treated with the phenylsilane coupling agent is 50% by mass or more. The semiconductor film adhesive also discloses a thermosetting resin, a curing agent, a thermoplastic resin, and an alumina filler surface-modified with phenyl. Based on the total amount of the semiconductor film adhesive, the content of the alumina filler surface-modified with phenyl is 50% by mass or more.
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