Adhesive composition, laminate, method for manufacturing laminate, and method for manufacturing semiconductor substrate or electronic device substrate after processing.

Abstract

This invention provides an adhesive composition exhibiting superior performance for bonding a support substrate to a semiconductor substrate or an electronic device substrate. This adhesive composition can form an adhesive layer with a good modulus of elasticity, is easily peelable from molding resin, and can form an adhesive layer with excellent heat resistance. The adhesive composition of this invention is used to form an adhesive layer disposed between a support substrate, a semiconductor substrate, or an electronic device substrate. The aforementioned adhesive composition contains an adhesive component (A) that is cured by a hydrogenation reaction. The aforementioned adhesive component (A) contains polysiloxane (A1), which contains siloxane units selected from those represented by SiO2 (Q unit), those represented by R1R2R3SiO1 / 2 (M unit), those represented by R4R5SiO2 / 2 (D unit), and those represented by R6SiO3 / 2 (T unit), as well as groups of siloxane units formed by combinations of two or more of these (R1 to R6 each independently represent a monovalent chemical group of alkyl, alkenyl, or hydrogen atoms having 1 to 10 carbon atoms, but R1 to R6 are bonded to silicon atoms by Si-C or Si-H bonds respectively); the aforementioned polysiloxane (A1) contains: Polyorganosiloxane (a1) (the aforementioned polyorganosiloxane (a1) has an alkenyl group having 2 to 10 carbon atoms and contains a siloxane unit (Q' unit) represented by SiO2 and a siloxane unit (M' unit) represented by R1'R2'R3'SiO1 / 2, where R1' to R3' independently represent methyl or vinyl groups), and polyorganosiloxane (a2) (the aforementioned polyorganosiloxane (a2) has a Si-H group and contains a siloxane unit selected from... SiO2 represents a siloxane unit (Q" unit), R1"R2"R3"SiO1 / 2 represents a siloxane unit (M" unit), R4"R5"SiO2 / 2 represents a siloxane unit (D" unit), R6"SiO3 / 2 represents a siloxane unit (T" unit), and groups of siloxane units formed by combinations of two or more of these, where R1" to R6" each independently represent an alkyl group or a hydrogen atom having 1 to 10 carbon atoms. For the aforementioned polyorganosiloxane (a1), the ratio of the functional groups of hydroxyl groups (x2) to the functional groups of vinyl groups (x1) of the aforementioned polyorganosiloxane (a1) as determined by nuclear magnetic resonance (NMR) measurement method, the ratio of the functional groups of hydroxyl groups to vinyl groups (X) of the aforementioned polyorganosiloxane (a1) calculated by the following formula (1) is 120 or less; the ratio of the functional groups of hydroxyl groups to vinyl groups (X) = (the ratio of the functional groups of hydroxyl groups (x2) / the ratio of the functional groups of vinyl groups (x1)) × 100 ・・・ (1).

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