Thermally conductive liquid epoxy resin composition and die bonding material for semiconductor devices

Abstract

This invention relates to a thermally conductive liquid epoxy resin composition, characterized by comprising: 100 parts by weight of (A) epoxy resin; 0.5 to 20 parts by weight of (B) silicone-modified epoxy resin; 0.05 to 20 parts by weight of (C) imidazole-based curing accelerator; and 400 to 1200 parts by weight of (D) sheet-like thermally conductive filler having an average particle size (D50) of 3 μm or more and a tap density of 4.0 to 10.0 g / cm³; wherein the aforementioned (A) epoxy resin comprises 20 to 90 parts by weight of aminophenol-type epoxy resin in 100 parts by weight, and the viscosity of the aforementioned thermally conductive liquid epoxy resin composition at 25°C is in the range of 1 to 100 Pa·s. This provides a resin composition and a die-bonding material for semiconductor devices, which exhibits excellent workability, low volatility during curing, and good adhesion retention of the cured resin composition after high-temperature storage. none