Cell culture wafers and cell culture apparatus

TW202634057APending Publication Date: 2026-08-16TOKYO OHKA KOGYO CO LTD +2
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Patent Information

Application Number
TW114139785
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-05
Filing Date
2025-10-15
Publication Date
2026-08-16

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Abstract

The present invention aims to provide a cell culture wafer that prevents air bubbles from being trapped in the wafer and reduces the deviation in the flow velocity distribution along the width of the flow path in a curved flow path for uniform cell seeding. The cell culture wafer (1) according to an embodiment of the present invention is: a cell culture wafer (1) comprising a stack (100, 200) having a flow path structure internally; the stack (100, 200) comprising a flow path substrate (L2, L4) having flow paths (F2, F4) leading to ports (P1, P2, P3, P4); the flow paths (P1, P2, P3, P4) comprising: a curved flow path (FC), which, in a top view of the flow path substrate (L2, L4), is formed in a curved shape. Furthermore, it has a gradually changing cross-sectional area in the direction of fluid flow; and a first connecting flow path (FJ1) connects the aforementioned port to the aforementioned curved flow path (FC), and has a fixed cross-sectional area in the direction of fluid flow; the cross-sectional area of ​​the aforementioned first connecting flow path (FJ1) is smaller than the minimum of the cross-sectional areas of the aforementioned ports (P1, P2, P3, P4) and the cross-sectional area of ​​the aforementioned curved flow path (FC); in the aforementioned top view, the flow path width of the aforementioned curved flow path (FC) gradually changes in the direction of fluid flow.
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