Radical gas height control between plasma source and wafer

Abstract

A flow assembly configured to change the angle of delivery of gas radicals to a wafer. The flow assembly may also change the shape of the gas radicals delivered to the wafer. For example, the flow assembly can compress the gas radicals in the x-y direction or allow for the expansion of the gas radicals. The flow assembly can include a single part which changes both the height and shape of the gas radicals. The flow assembly can include multiple parts, for example, a compression part for compressing the gas radicals in the x-y direction and a ramp part for elevating the gas radicals. The angle of delivery can be changed

Images