Plating equipment and diagnostic methods for plating equipment

Abstract

This invention can accurately control the operating state of a plating apparatus. The invention provides a plating apparatus for forming a plating film on a substrate, comprising: a substrate holder configured to hold the substrate; a plating tank configured to accommodate the substrate holder and a plating solution; an anode disposed in the plating tank facing the substrate held by the substrate holder; a film thickness measuring unit configured to measure the film thickness of the plating film formed on the substrate at various points on the substrate; and a control unit for controlling the plating apparatus. The control unit comprises: an imaging subunit configured to generate an image displaying the film thickness distribution on the substrate based on the film thickness measurements of the plating film formed on the substrate at various points on the substrate; a machine learning model configured to be trained to output a presumed state related to the plating process of the plating apparatus if the image is input; and a diagnostic subunit configured to diagnose the plating apparatus based on the presumed state output from the machine learning model.

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