Liquid manifold assembly for electronics enclosure

TW202634209APending Publication Date: 2026-08-16HOFFMAN ENCLOSURES INC
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Patent Information

Application Number
TW114149949
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-12-18
Publication Date
2026-08-16

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Abstract

A manifold mounting system for an electronics rack can include a manifold assembly and mounting assembly. The manifold assembly can include a manifold tube extending between upper and lower ends along a longitudinal axis with first and second walls opposite each other, multiple ports extending from a third wall, and a guide pin extending from the third wall. The mounting assembly can include a bracket for securing the manifold assembly to the electronics rack. The bracket can include a front flange with a slot for receiving the guide pin, opposing side flanges each with at least one aperture, and at least one fastener extending through the apertures and through the first and second walls when mounted.
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