Probe cards, probe tips, probe systems, and testing methods for high-frequency testing

Abstract

A probe head includes a guide plate unit and a plurality of probes passing through the guide plate unit. Each probe includes upper and lower ends and an elongated needle body extending between the upper and lower ends. The plurality of probes includes a plurality of signal probes and at least one compensation probe. The lower end of each signal probe is positioned lower in the vertical axis than the lower end of the compensation probe. The lower end of the signal probe is used to contact a conductive contact of the device under test. The plurality of signal probes includes first and second signal probes that are electrically separated from each other. The first signal probe is electrically connected to a compensation probe. Therefore, the present invention can effectively improve the signal transmission impedance matching effect even when the signal probe spacing is limited, thereby meeting the requirements of high-frequency testing.

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