Wiring substrate and electrical connecting apparatus

Abstract

The objective of this invention is to reduce the thermal expansion coefficient of a substrate that changes with temperature without severely compromising electrical properties, and to keep pace with changes in the semiconductor wafer. As a solution, the wiring substrate of this invention includes a thin-film wiring portion electrically connected to a plurality of connection terminals that bring contacts into contact with electrode terminals on the semiconductor wafer. The thin-film wiring portion has a first conductive layer and a second conductive layer with a lower thermal expansion coefficient than the first conductive layer. At least, the first conductive layer is the conductive layer furthest from the semiconductor wafer, and the second conductive layer is the conductive layer closest to the semiconductor wafer.

Images