Die-to-die bypass mode for chiplet initialization, configuration, and communication

Abstract

The described technology provides a device including. a transmitter configured on a transmitting die, a receiver configured on a receiving die, an interposer configured to communicate between the transmitting die and the receiving die at a test frequency that is equal or lower than the normal operating frequency of the system on a system on chip (SoC), and a plurality of pins configured on each of the transmitting die and the receiving die, wherein the plurality of pins are configured to communicate with the interposer at the test frequency.

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