Machine and method for testing light emitting substrate

Abstract

A machine and method for testing a light emitting substrate are provided. In the method, a load board is provided in a test region. The load board includes a first conductive area and a second conductive area that have different conductivities. Afterwards, an anisotropic conductive layer is disposed on the load board and covers the first conductive area and the second conductive area. Afterwards, a light emitting substrate is retained in the test region, and one of the light emitting substrate and the load board is driven to move towards the other of the light emitting substrate and the load board, such that the anisotropic conductive layer is pressed between the light emitting substrate and the load board to form signal conduction paths. Lastly, test signals are provided to the light-emitting substrate through the load board. Therefore, the effects of shortening test time, simplifying test operation, reducing test difficulty, and increasing test accuracy can be achieved.

Description

[Technical Field]

[0001] This invention relates to the field of light-emitting device testing, and in particular to a testing machine and testing method for a light-emitting substrate. [Previous Technology]

[0002] A light-emitting diode (LED) is a light-emitting device that converts electrical energy into light energy. It has advantages such as small size, high luminous efficiency, long lifespan, high reliability, fast response time, energy saving, and environmental friendliness, and is widely used in lighting, display, and communication fields. The performance of LEDs directly affects the actual application effect; therefore, accurate testing of LEDs is crucial to ensure their performance.

[0003] Micro LEDs possess excellent display performance and are considered a next-generation display technology. However, due to the extremely small size of micro LED chips (less than 100 micrometers), their large number and high density per unit area make testing difficult and inefficient. For example, current technology uses a probe to contact the contacts (electrodes) of the chip under test and apply voltage to light up the micro LED for testing; testing every single chip on an entire light-emitting substrate can take hours or even hundreds of hours. Although multiple chips can be powered simultaneously via an interposer, structural differences in height may prevent some chips from being lit. [Summary of the Invention]

[0004] The technical problem to be solved by the present invention is to provide a testing machine and testing method for light-emitting substrates that can meet the performance testing needs of light-emitting diodes with small size, large quantity and high density, and provide an economical, reliable and efficient testing environment.

[0005] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a testing method for a light-emitting substrate, which includes: providing a test carrier plate in a test area, the test carrier plate including a first conductive region and a second conductive region of different electrical properties; disposing an anisotropic conductive layer on the test carrier plate, the anisotropic conductive layer covering the first conductive region and the second conductive region; fixing a light-emitting substrate at a position aligned with the test area, and driving one of the light-emitting substrate and the test carrier plate to move towards each other, so that the anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier plate to form signal conduction; and providing a test signal to the light-emitting substrate through the test carrier plate. The light-emitting substrate includes a first conductive semiconductor layer and a plurality of light-emitting units and a first conductive structure formed on the first conductive semiconductor layer, the first conductive structure being located on one side of the plurality of light-emitting units; each light-emitting unit includes a light-emitting layer located on the first conductive semiconductor layer, a second conductive semiconductor layer located on the light-emitting layer, and a second conductive structure located on the second conductive semiconductor layer. The test signal includes a first test signal and a second test signal. The first test signal passes sequentially through the first conductive area of ​​the test carrier and the anisotropic conductive layer to be transmitted to the first conductive structure of the light-emitting substrate. The second test signal passes sequentially through the second conductive area of ​​the test carrier and the anisotropic conductive layer to be transmitted to the second conductive structure of each light-emitting unit of the light-emitting substrate.

[0006] In a feasible or preferred embodiment of the present invention, the step of providing the test signal to the light-emitting substrate includes: obtaining at least one light-emitting characteristic parameter of each light-emitting unit of the light-emitting substrate through a light sensor.

[0007] In a feasible or preferred embodiment of the present invention, in the step of pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier plate to form a conductive path, the test carrier plate remains stationary, and the light-emitting substrate is driven to move toward the test carrier plate to press the anisotropic conductive layer between the light-emitting substrate and the test carrier plate.

[0008] In a feasible or preferred embodiment of the present invention, in the step of pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier to form a conductivity, the light-emitting substrate remains stationary, and the test carrier is driven to move toward the light-emitting substrate to press the anisotropic conductive layer between the light-emitting substrate and the test carrier.

[0009] In a feasible or preferred embodiment of the present invention, when the light-emitting substrate and the test carrier plate are pressing the anisotropic conductive layer, a first alignment mark on the light-emitting substrate and a second alignment mark on the test carrier plate are aligned with each other.

[0010] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a testing machine for a light-emitting substrate, which includes a testing area, a testing component, a holder, and a driver. The testing component is disposed in the testing area, and the testing component includes a testing carrier plate and an anisotropic conductive layer; the testing carrier plate includes a first conductive region and a second conductive region with different electrical properties, and the anisotropic conductive layer is disposed on the testing carrier plate and covers the first conductive region and the second conductive region. The holder is configured to hold a light-emitting substrate in a position aligned with the testing area. The driver is configured to drive one of the light-emitting substrate and the testing carrier plate to move toward each other, so that the anisotropic conductive layer is pressed between the light-emitting substrate and the testing carrier plate to form a signal conduction. The light-emitting substrate includes a first conductive semiconductor layer and a plurality of light-emitting units and a first conductive structure formed on the first conductive semiconductor layer. The first conductive structure is located on one side of the plurality of light-emitting units. Each light-emitting unit includes a light-emitting layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the light-emitting layer, and a second conductive structure on the second conductive semiconductor layer. The test carrier is configured to provide test signals to the light-emitting substrate, including a first test signal and a second test signal. The first test signal sequentially passes through the first conductive region and the anisotropic conductive layer of the test carrier to be transmitted to the first conductive structure of the light-emitting substrate, and the second test signal sequentially passes through the second conductive region and the anisotropic conductive layer of the test carrier to be transmitted to the second conductive structure of each light-emitting unit of the light-emitting substrate.

[0011] In a feasible or preferred embodiment of the present invention, the testing equipment for the light-emitting substrate further includes a light sensor, and the light sensor is configured to obtain at least one light-emitting characteristic parameter of each of the light-emitting units of the light-emitting substrate.

[0012] In a feasible or preferred embodiment of the present invention, the holder is a light-permeable adsorption fixation device, and the light sensor is disposed above the adsorption fixation device.

[0013] In a feasible or preferred embodiment of the present invention, the test substrate remains stationary within the test area, and the driver drives the holder to move the light-emitting substrate toward the test substrate, thereby pressing the anisotropic conductive layer between the light-emitting substrate and the test substrate.

[0014] In a feasible or preferred embodiment of the present invention, the light-emitting substrate remains stationary within the test area, and the driver drives the test assembly to move the test carrier toward the light-emitting substrate, thereby pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier.

[0015] One of the beneficial effects of the present invention is that the testing machine and testing method for the light-emitting substrate provided by the present invention, by means of "the test carrier plate including a first conductive area and a second conductive area with a special layout design, an anisotropic conductive layer disposed on the test carrier plate and covering the first conductive area and the second conductive area" and "driving one of the light-emitting substrate and the test carrier plate to move toward each other so that the anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier plate to form signal conduction", can shorten the testing time, simplify the testing operation, reduce the testing difficulty and improve the testing accuracy.

[0016] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0026] The following specific embodiments illustrate the implementation of the "testing machine and testing method for light-emitting substrates" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0027] It should be understood that although terms such as “first,” “second,” and “third” may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term “or” as used herein may include, as appropriate, any combination of any one or more of the associated listed items.

[0028] In the fabrication process of light-emitting substrates, the small size, large number, and high density of light-emitting devices (such as light-emitting diodes) make testing difficult and inefficient. Therefore, this invention provides an innovative testing technique that combines an anisotropic conductive layer with a test substrate having a special conductive pattern layout design as a test component for testing the photoelectric performance of light-emitting substrates.

[0029] Referring to Figures 1 to 4, the present invention provides a testing machine 1 for a light-emitting substrate employing the above-described technical means, comprising a testing area 11A, a testing component 12, a holder 13, and a driver 14. The testing component 12 is disposed within the testing area 11A and includes a testing carrier plate 121 and an anisotropic conductive layer 122 disposed on the testing carrier plate 121. The holder 13 is configured to hold a light-emitting substrate 2 to be tested within the testing area 11A. The driver 14 is configured to drive one of the light-emitting substrate 2 and the testing carrier plate 121 to move towards each other, so that the anisotropic conductive layer 122 is pressed between the light-emitting substrate 2 and the testing carrier plate 121 to form signal conduction. Based on this, a test signal can be provided to the light-emitting substrate 2 through the testing carrier plate 121, and its performance can be judged based on the light-emitting characteristics or electrical signals responded by the light-emitting substrate 2.

[0030] In practical applications, the testing machine 1 of the present invention may include a worktable 11 having a testing area 11A. Additionally, the testing assembly 12 may include a mounting fixture (not shown) to integrate the test carrier 121 and the anisotropic conductive layer 122, and the mounting fixture can quickly position the test carrier 121 on the worktable 11. However, the above descriptions are merely feasible embodiments and are not intended to limit the present invention.

[0031] The workbench 11 can be disposed in an open space, and the test carrier 121 is configured to remain stationary relative to the workbench 11 or move or rotate within the test area 11A. The test carrier 121 includes a first conductive area 121A and a second conductive area 121B with different electrical properties, and an anisotropic conductive layer 122 covers the first conductive area 121A and the second conductive area 121B. In practical applications, the first conductive area 121A and the second conductive area 121B can have a layout design that matches the light-emitting substrate 2, that is, the pattern and position of the first conductive area 121A and the second conductive area 121B can be changed according to the structure and arrangement of the light-emitting substrate 2. For example, the first conductive area 121A can be composed of two separate conductor patterns, and the second conductive area 121B can be composed of a single conductor pattern located between the two conductor patterns of the first conductive area 121A; the conductor can be copper or a copper alloy. However, the present invention is not limited to the examples given above.

[0032] As shown in FIG. 5, the light-emitting substrate 2 includes a first conductive semiconductor layer 21 and a plurality of light-emitting units 22 and a first conductive structure 23 formed on the first conductive semiconductor layer 21. The plurality of light-emitting units 22 can be arranged in an array on the first conductive semiconductor layer 21, and the first conductive structure 23 can be located on one side of the plurality of light-emitting units 22. Each light-emitting unit 22 includes a light-emitting layer 221, a second conductive semiconductor layer 222, and a second conductive structure 223 sequentially formed on the first conductive semiconductor layer 21. The first conductive structure 23 can serve as an n-type electrode, and the second conductive structure 223 can serve as a p-type electrode.

[0033] In practical applications, the first conductive semiconductor layer 21, the complex light-emitting units 22, and the first conductive structure 23 can be grown on a substrate 24 (such as a sapphire substrate). The first conductive semiconductor layer 21 can be a gallium nitride (GaN)-based n-type semiconductor layer, and the second conductive semiconductor layer 222 of each light-emitting unit 22 can be a gallium nitride-based p-type semiconductor layer. In addition, the light-emitting layer 221 of each light-emitting unit 22 can be a quantum well layer, and the first conductive structure 23 and the second conductive structure 223 of each light-emitting unit 22 can each be a contact pad formed of a transparent conductive material (such as indium tin oxide). However, the present invention is not limited to the examples given above.

[0034] Further referring to Figure 6, when the anisotropic conductive layer 122 is pressed between the light-emitting substrate 2 and the test carrier 121, a first test signal (such as a negative voltage) can be provided from the first conductive region 121A of the test carrier 121, and a second test signal (such as a positive voltage) can be provided from the second conductive region 121B of the test carrier 121. The first test signal is transmitted through the anisotropic conductive layer 122 to the first conductive structure 23 of the light-emitting substrate 2, and the second test signal is transmitted through the anisotropic conductive layer 122 to the second conductive semiconductor layer 222 of each light-emitting unit 22, so that each light-emitting unit 22 emits light to test its performance.

[0035] It is worth mentioning that the anisotropic conductive layer 122 is formed of anisotropic conductive material, which has the characteristics of being electrically conductive in the Z direction and insulating in the XY direction, and is elastic. When compressed, it can be tightly attached to the first conductive structure 23 and the second conductive structure 223, and can even cover part of the first conductive structure 23 or the second conductive structure 223 from the side. Therefore, the anisotropic conductive layer 122 can maintain stable and reliable contact and good conductivity with the first and second conductive structures 23 and 223 during the test, and will not be affected by the height difference of the structure.

[0036] As shown in Figures 1 and 2, in the test operation of one feasible embodiment of the present invention, the test carrier 121 remains stationary in the test area 11A, and the driver 14 drives the connection holder 13 to move the light-emitting substrate 2 toward the test carrier 121 (i.e., move it downward), so that the anisotropic conductive layer 122 is pressed between the light-emitting substrate 2 and the test carrier 121.

[0037] As shown in Figures 3 and 4, in the test operation of another feasible embodiment of the present invention, the light-emitting substrate 2 remains stationary in the test area 11A, and the driver 14 drives the connected test component 12, such as the mounting fixture (not shown in Figures 3 and 4) of the connected test component 12, to drive the test carrier plate 121 to move toward the light-emitting substrate 2 (i.e., move upward), so that the anisotropic conductive layer 122 is pressed between the light-emitting substrate 2 and the test carrier plate 121.

[0038] In practical applications, a first alignment mark M1 can be formed on the light-emitting substrate 2, and a second alignment mark M2 can be formed on the test carrier 121, with the positions of the first alignment mark M1 and the second alignment mark M2 corresponding to each other. Therefore, during the testing operation, the first alignment mark M1 on the light-emitting substrate 2 and the second alignment mark M2 on the test carrier 121 can be aligned with each other to achieve precise vertical alignment.

[0039] In this invention, the testing equipment 1 may further include a light sensor 15, and the light sensor 15 is configured to obtain at least one light emission characteristic parameter of each light emission unit 22 of the light emission substrate 2, such as brightness and / or chromaticity (color coordinates). In practical applications, the holder 13 may be a light-transmitting adsorption fixture, the light sensor 15 may be disposed above the holder 13, and the light sensor 15 may include a light analyzer (such as a spectrometer).

[0040] Referring to Figures 7 and 8, in another feasible embodiment of the present invention, the light-emitting substrate 2 to be tested is held on the worktable 11 and kept stationary within the test area 11A; the holder 13 is configured to hold the test component 12 above the worktable 11 and align it with the light-emitting substrate 2 within the test area 11A; the driver 14 drives the holder 13, for example, a mounting fixture (not shown in Figures 7 and 8) connected to the test component 12, to drive the holder 13 to move the test carrier 121 toward the light-emitting substrate 2 (i.e., downward), thereby pressing the anisotropic conductive layer 122 between the test carrier 121 and the light-emitting substrate 2 to form a signal conduction. Additionally, the photosensor 15 can be configured to obtain at least one light-emitting characteristic parameter of each light-emitting unit 22 of the light-emitting substrate 2 from below the worktable 11. For example, the photosensor 15 can be disposed below the worktable 11.

[0041] Referring to Figure 9, the present invention also provides a testing method for a light-emitting substrate, which can be implemented by the testing apparatus described in the preceding paragraph. The testing method of the present invention includes: step S100, providing a test carrier plate in a test area; step S102, disposing an anisotropic conductive layer on the test carrier plate; step S104, fixing a light-emitting substrate in the test area, and driving one of the light-emitting substrate and the test carrier plate to move towards each other, so that the anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier plate to form signal conduction; and step S106, providing a test signal to the light-emitting substrate through the test carrier plate.

[0042] As shown in Figures 1 to 4, in step S104, the test substrate 121 can be kept stationary, and the light-emitting substrate 2 can be driven to move toward the test substrate 121 to press the anisotropic conductive layer 122 between the light-emitting substrate 2 and the test substrate 121; or, the light-emitting substrate 2 can be kept stationary, and the test substrate 121 can be driven to move toward the light-emitting substrate 2 to press the anisotropic conductive layer 122 between the light-emitting substrate 2 and the test substrate 121. Optionally, when pressing the anisotropic conductive layer 122, the light-emitting substrate 2 and the test substrate 121 can be aligned by aligning a first alignment mark M1 on the light-emitting substrate 2 with a second alignment mark M2 on the test substrate 121 to achieve precise vertical alignment. In addition, in step S106, at least one light-emitting characteristic parameter of each light-emitting unit 22 of the light-emitting substrate 2 can be measured by a photosensor 15.

[0043] [Beneficial Effects of the Embodiments]

[0044] One of the beneficial effects of the present invention is that the testing machine and testing method for the light-emitting substrate provided by the present invention, by means of "the test carrier plate including a first conductive area and a second conductive area with a special layout design, an anisotropic conductive layer disposed on the test carrier plate and covering the first conductive area and the second conductive area" and "driving one of the light-emitting substrate and the test carrier plate to move toward each other so that the anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier plate to form signal conduction", can shorten the testing time, simplify the testing operation, reduce the testing difficulty and improve the testing accuracy.

[0045] Furthermore, the present invention combines an anisotropic conductive layer with a test substrate having a special conductive pattern layout design as a test component for testing the photoelectric performance of a light-emitting substrate. The anisotropic conductive layer is formed of anisotropic conductive material, which has the characteristics of being electrically conductive in the Z direction and insulating in the XY direction, and is elastic. When squeezed, it can simultaneously and tightly adhere to the test substrate and the light-emitting device under test, so as to maintain stable and reliable contact and good conductivity during the test, and is not affected by structural height differences.

[0046] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0017] Figure 1 is a schematic diagram of one of the transfer operations of the test machine for the light-emitting substrate according to the first embodiment of the present invention.

[0018] Figure 2 is a schematic diagram of another transfer operation of the test machine for the light-emitting substrate of the first embodiment of the present invention.

[0019] Figure 3 is a schematic diagram of one of the transfer operations of the test machine for the light-emitting substrate according to the second embodiment of the present invention.

[0020] Figure 4 is a schematic diagram of another transfer operation of the test machine for the light-emitting substrate according to the second embodiment of the present invention.

[0021] Figure 5 is a schematic diagram of the structure of the light-emitting substrate to be tested.

[0022] Figure 6 is a schematic diagram of the test operation of the test machine for the light-emitting substrate of the first and second embodiments of the present invention, wherein an anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier to form signal conduction.

[0023] Figure 7 is a schematic diagram of one of the transfer operations of the test machine for the light-emitting substrate according to the third embodiment of the present invention.

[0024] Figure 8 is a schematic diagram of another transfer operation of the test machine for the light-emitting substrate according to the third embodiment of the present invention.

[0025] Figure 9 is a flowchart of the testing method for the light-emitting substrate of the present invention.

Claims

1. A testing method for a light-emitting substrate, comprising: A test substrate is provided in a test area, the test substrate including a first conductive region and a second conductive region of different electrical properties; an anisotropic conductive layer is disposed on the test substrate, the anisotropic conductive layer covering the first conductive region and the second conductive region; a light-emitting substrate is fixed at a position aligned with the test area, and one of the light-emitting substrate and the test substrate is driven to move towards each other, so that a signal conduction is formed between the light-emitting substrate and the test substrate through the anisotropic conductive layer; and a test signal is provided to the light-emitting substrate through the test substrate; wherein, the light-emitting substrate includes a first conductive semiconductor layer and a plurality of light-emitting units and a first conductive structure formed on the first conductive semiconductor layer, the first conductive structure being located on one side of the plurality of light-emitting units; each light-emitting unit includes a light-emitting layer located on the first conductive semiconductor layer, a second conductive semiconductor layer located on the light-emitting layer, and a second conductive structure located on the second conductive semiconductor layer; The test signal includes a first test signal and a second test signal. The first test signal passes sequentially through the first conductive area of ​​the test carrier and the anisotropic conductive layer to be transmitted to the first conductive structure of the light-emitting substrate. The second test signal passes sequentially through the second conductive area of ​​the test carrier and the anisotropic conductive layer to be transmitted to the second conductive structure of each light-emitting unit of the light-emitting substrate.

2. The test method for the light-emitting substrate as described in claim 1, wherein, The step of providing the test signal to the light-emitting substrate includes: obtaining at least one light-emitting characteristic parameter of each light-emitting unit of the light-emitting substrate through a light sensor.

3. The test method for the light-emitting substrate as described in claim 1, wherein, In the step of pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier to form a conductive path, the test carrier remains stationary, and the light-emitting substrate is driven to move toward the test carrier to press the anisotropic conductive layer between the light-emitting substrate and the test carrier.

4. The test method for the light-emitting substrate as described in claim 1, wherein, In the step of pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier to form a conductive path, the light-emitting substrate remains stationary, and the test carrier is driven to move toward the light-emitting substrate to press the anisotropic conductive layer between the light-emitting substrate and the test carrier.

5. The test method for the light-emitting substrate as described in claim 3 or 4, wherein, When the anisotropic conductive layer is pressed between the light-emitting substrate and the test carrier, a first alignment mark on the light-emitting substrate and a second alignment mark on the test carrier are aligned with each other.

6. A testing machine for a light-emitting substrate, comprising: One test area; A test assembly is disposed within the test area. The test assembly includes a test substrate and an anisotropic conductive layer. The test substrate includes a first conductive region and a second conductive region with different electrical properties. The anisotropic conductive layer is disposed on the test substrate and covers the first conductive region and the second conductive region. A holder is configured to hold a light-emitting substrate within the test area. A driver is configured to drive one of the light-emitting substrate and the test substrate to move toward each other, so that a signal conduction is formed between the light-emitting substrate and the test substrate through the anisotropic conductive layer. The light-emitting substrate includes a first conductive semiconductor layer and a plurality of light-emitting units and a first conductive structure formed on the first conductive semiconductor layer. The first conductive structure is located on one side of the plurality of light-emitting units. Each light-emitting unit includes a light-emitting layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the light-emitting layer, and a second conductive structure on the second conductive semiconductor layer. The test carrier is configured to provide test signals to the light-emitting substrate; the test signals include a first test signal and a second test signal, wherein the first test signal passes sequentially through the first conductive region and the anisotropic conductive layer of the test carrier to be transmitted to the first conductive structure of the light-emitting substrate, and the second test signal passes sequentially through the second conductive region and the anisotropic conductive layer of the test carrier to be transmitted to the second conductive structure of each light-emitting unit of the light-emitting substrate.

7. The testing equipment for the light-emitting substrate as described in claim 6 further includes a light sensor, and the light sensor is configured to acquire at least one light-emitting characteristic parameter of each of the light-emitting units of the light-emitting substrate.

8. A testing machine for the light-emitting substrate as described in claim 7, wherein, The holder is a light-permeable adsorption fixture, and the light sensor is disposed above the adsorption fixture.

9. The testing equipment for the light-emitting substrate as described in claim 7, further comprising a worktable having the testing area, wherein the light sensor is disposed below the worktable.

10. A testing machine for a light-emitting substrate as described in claim 6 or 7, wherein, The test substrate remains stationary within the test area, and the driver drives the holder to move the light-emitting substrate toward the test substrate, thereby pressing the anisotropic conductive layer between the light-emitting substrate and the test substrate.

11. A testing machine for a light-emitting substrate as described in claim 6 or 7, wherein, The light-emitting substrate remains stationary within the test area, and the driver drives the test assembly to move the test carrier toward the light-emitting substrate, thereby pressing the anisotropic conductive layer between the light-emitting substrate and the test carrier.

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