Photonic package, photonic system and method of manufacturing photonic system

TW202634305APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114112539
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-11
Filing Date
2025-04-01
Publication Date
2026-08-16

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Abstract

A photonic package includes a photonic die and an electronic die disposed over a front side of the photonic die. The photonic die includes an optical coupler and a recess extending from a back side of the photonic die toward the front side of the photonic die, wherein the recess includes a first facet at an end of the optical coupler and a second facet opposite to the first facet and non-parallel to the first facet for reflecting light to or from the optical coupler.
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