High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits

TW202634317APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114140839
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-05-15
Filing Date
2025-10-22
Publication Date
2026-08-16

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Abstract

An optical interface includes a cladding layer having a plurality of inner cores and a plurality of turning elements formed therein. Each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements. The optical interface further includes an array of optical elements formed on the cladding layer. Each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements.
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