Optical device processing
TW202634330APending Publication Date: 2026-08-16FLEXENABLE TECH LTD
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Patent Information
- Application Number
- TW114148475
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-10
- Filing Date
- 2025-12-10
- Publication Date
- 2026-08-16
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Abstract
There is disclosed a stack for processing a device layer on a rigid substrate, comprising: a rigid substrate layer; a first conductive layer on the rigid substrate layer; an electric debond adhesive layer on the first conductive layer; a second conductive layer on the electric debond adhesive layer.
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