Real-time sensor processing to measure substrate offsets and apply corrections to chamber member positioning

TW202634380APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114139660
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-10
Filing Date
2025-10-15
Publication Date
2026-08-16

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Abstract

A system includes a chamber having a substrate support and an upper member having an upper member surface positioned within the chamber that is vertically movable relative to the substrate support. One or more sensors each measure an edge location of a substrate on the substrate support. A linear stage assembly is coupled to the upper member and first and second motors operatively are coupled to a first side of a first linear stage and a second side of a second linear stage of a set of linear stages to move the linear stage assembly in a first direction and in a second direction. Control logic receives the edge location, determines an offset value of the substrate relative to the edge location, and controls at least one of the first or second motor using the offset value to center the upper member surface over the substrate.
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