Methods and systems for arc suppression during semiconductor fabrication processes
TW202634657APending Publication Date: 2026-08-16APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114138559
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-14
- Filing Date
- 2025-10-07
- Publication Date
- 2026-08-16
Smart Images

Figure TWG2TA001072698_001 
Figure TWG2TA001072698_002 
Figure TWG2TA001072698_003
Abstract
The techniques described herein relate to suppresion of arcs during plasma-based semiconductor processes. The techniques can include delivering radio-frequency (RF) power a plasma in a semiconductor processing chamber. The techniques can include detecting a first indication of a first arc event in the semiconductor processing chamber. In response to detecting the first indication of the first arc event, causing the RF power to the plasma to pulse. Causing the RF power to the plasma to pulse can include repeatedly causing the RF power to pulse on and off to suppress the first arc event.
Need to check novelty before this filing date? Find Prior Art