Cabinet and server

Abstract

A cabinet and a server, wherein the chassis includes a main frame, a heat sink, and a first bracket. The main frame is used to mount a motherboard, and the motherboard is provided with a first motherboard mounting portion. The main frame is used to mount the motherboard. The first bracket connects the heat sink to the motherboard, and the heat sink is fixed to the motherboard. The first bracket is bent to form a first motherboard connection section, a first intermediate section, and a first heat sink connection section that are connected in sequence, the first motherboard connection section has a first motherboard fitting section, the first heat sink connection section has a first heat sink fitting section, the relative position between the first motherboard fitting section and the first motherboard mounting section is adjustable, and the relative position between the first heat sink fitting section and the first heat sink mounting section is adjustable, so that the position of the heat sink relative to the heat generating device can be adjusted. The relative position between the first heat sink fitting portion and the first heat sink mounting portion is adjustable so that the position of the heat sink relative to the heat generating device is adjustable.

Description

[Technical Field]

[0001] This application relates to the field of server structure technology, specifically a host shell and a server. [Previous Technology]

[0002] Currently, servers typically use water-cooled plates to cool the processor on the motherboard, and the water-cooled plates are fixed to the motherboard. However, in related technologies, the fixed position of the water-cooled plate and the motherboard cannot be adjusted. Due to manufacturing errors or human factors, the water-cooled plate may sometimes deviate from the processor after installation, making it impossible for the water-cooled plate to fully contact the processor, resulting in reduced heat dissipation efficiency. [Summary of the Invention]

[0003] In view of this, it is necessary to provide a host housing and server with adjustable heat sink position.

[0004] In one embodiment of this application, a host housing is provided, including a main frame, a heat sink, and a first bracket. The main frame is configured to mount a host board, the host board having a heat-generating device, and the host board having a first host board mounting portion. The heat sink is configured to conduct heat to the heat-generating device to dissipate heat, and the heat sink has a first heat sink mounting portion. The first bracket connects the heat sink and the host board, and the heat sink is fixed to the host board by the first bracket to fix the position of the heat sink relative to the heat-generating device. The first bracket is bent to form a first host board connecting segment, a first intermediate segment, and a first heat sink connecting segment connected in sequence. The first host board connecting segment has a first host board mating portion, and the first heat sink connecting segment has a first heat sink mating portion. The first host board mating portion is used to connect to the first host board mounting portion, and the relative position between the first host board mating portion and the first host board mounting portion is adjustable. The first heat sink mating portion is used to connect to the first heat sink mounting portion, and the relative position between the first heat sink mating portion and the first heat sink mounting portion is adjustable, so that the position of the heat sink relative to the heat-generating device is adjustable.

[0005] When the above-mentioned main unit housing is in use, the first main unit mating part is connected to the first main unit mounting part, and the relative position between the first main unit mating part and the first main unit mounting part is adjustable. The first heat sink mating part is connected to the first heat sink mounting part, and the relative position between the first heat sink mating part and the first heat sink mounting part is adjustable, so that the position of the heat sink relative to the heat-generating device is adjustable, thereby allowing the heat sink to be adjusted to a position that fully contacts the heat-generating device, thereby ensuring heat dissipation efficiency.

[0006] In some embodiments, the main unit housing further includes screws, the first main board mounting portion is a screw hole, the first main board mating portion is a slotted hole, the area of ​​the slotted hole is larger than the area of ​​the screw hole, the screw hole is selectively aligned with any position of the slotted hole, so that the position of the first bracket relative to the main board is adjustable, the screw passes through the slotted hole and is threaded into the screw hole, the head of the screw is used to press the first main board connecting section to fix the first bracket and the main board, and / or, the first heat sink mounting portion is a screw hole, the first heat sink mating portion is a slotted hole, the area of ​​the slotted hole is larger than the area of ​​the screw hole, the screw hole is selectively aligned with any position of the slotted hole, so that the position of the first bracket relative to the heat sink is adjustable, the screw passes through the slotted hole and is threaded into the screw hole, the head of the screw is used to press the first heat sink connecting section to fix the first bracket and the heat sink.

[0007] In some embodiments, the main unit housing further includes screws, the first main board mounting portion is a screw hole, the first main board mating portion is a plurality of through holes, each through hole having the same diameter as the screw hole, the screw hole selectively aligning with any one of the through holes, so that the position of the first bracket relative to the main board is adjustable, the screw passes through the through hole and is threaded into the screw hole, the head of the screw is used to press the first main board connecting section to fix the first bracket and the main board, and / or, the first heat sink mounting portion is a screw hole, the first heat sink mating portion is a plurality of through holes, each through hole having the same diameter as the screw hole, the screw hole selectively aligning with any one of the through holes, so that the position of the first bracket relative to the heat sink is adjustable, the screw passes through the through hole and is threaded into the screw hole, the head of the screw is used to press the first heat sink connecting section to fix the first bracket and the heat sink.

[0008] In some embodiments, both the first heat sink mounting part and the first heat sink mating part are ball holes. The main housing also includes a ball head rod, with ball heads at both ends. The ball head at one end of the ball head rod is located in the ball hole of the first heat sink mounting part, and the ball head at the other end of the ball head rod is located in the ball hole of the first heat sink mating part. The ball head can rotate in the ball hole, so that the relative position between the first bracket and the heat sink can be adjusted.

[0009] In some embodiments, the projections of the first motherboard connecting segment, the first intermediate segment, and the first heat sink connecting segment onto the motherboard extend along the same straight line. The first motherboard connecting segment and the first heat sink connecting segment are parallel to the motherboard. There is a height difference between the first motherboard connecting segment and the first heat sink connecting segment relative to the motherboard. The first intermediate segment is inclined relative to the first motherboard connecting segment and the first heat sink connecting segment. The included angle between the first intermediate segment and the first motherboard connecting segment is an obtuse angle.

[0010] In some embodiments, the heat sink includes a lower plate and an upper plate, the lower plate and the upper plate are covered, the lower plate is provided with a receiving cavity on one side facing the upper plate, the upper plate is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are connected to the receiving cavity, the lower plate is attached to the heat-generating device on one side away from the upper plate, and the coolant enters the receiving cavity through the liquid inlet and then flows out from the liquid outlet.

[0011] In some embodiments, the lower plate portion is provided with a plurality of spaced columns in the receiving cavity, the columns reducing the flow rate of the coolant.

[0012] In some embodiments, the cross-section of the receiving cavity is circular, a column is provided at the center of the receiving cavity, and rings of different diameters are formed around the center of the receiving cavity. The remaining multiple columns are arranged along each ring, and the liquid inlet and liquid outlet are symmetrically arranged with respect to the axis of the receiving cavity.

[0013] In some embodiments, the heat sink is rectangular, and the motherboard is also provided with a second motherboard mounting part, a third motherboard mounting part and a fourth motherboard mounting part that are the same as the first motherboard mounting part. The heat sink is also provided with a second heat sink mounting part, a third heat sink mounting part and a fourth heat sink mounting part that are the same as the first heat sink mounting part. The motherboard housing also includes a second bracket, a third bracket and a fourth bracket that are the same as the first bracket. The second bracket is correspondingly connected to the second motherboard mounting part and the second heat sink mounting part, the third bracket is correspondingly connected to the third motherboard mounting part and the third heat sink mounting part, and the fourth bracket is correspondingly connected to the fourth motherboard mounting part and the fourth heat sink mounting part. The first bracket, the second bracket, the third bracket and the fourth bracket are respectively located at the four right angles of the heat sink.

[0014] In one embodiment of this application, a server is provided, including a motherboard and a host shell as described in any of the above embodiments.

Implementation Method

[0015] The technical solution of this application will be described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0016] It should be noted that when an element is considered to be "connected to" or "located on" another element, it can be directly connected to the other element or may have an element centrally located. In this application, unless otherwise expressly specified and limited, the terms "installed," "connected," "fixed," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0017] In the description of the embodiments of this application, the meaning of "multiple" may also be two or more, unless otherwise explicitly specified. The shape descriptions such as length, thickness, and width in the embodiments of this application are merely illustrative and should not constitute any absolute limitation on this application. The terms "vertical" and "horizontal" are used to describe the ideal state between two components. In actual production or use, there may be a state that is approximately vertical or horizontal.

[0018] The reference to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Where there is no conflict, the various embodiments in this application may be combined with each other.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms “comprising,” “having,” and “equipped with,” and any variations thereof, in the specification, claims, and foregoing description of the drawings, are intended to cover non-exclusive inclusion.

[0020] Some embodiments of this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0021] Please refer to Figures 1 to 3. In one embodiment of this application, a server 200 is provided, including a host housing 100 and a motherboard 300. The motherboard is provided with a heat-generating device 301. Exemplarily, the heat-generating device 301 is a central processing unit. The host housing 100 includes a main frame 10, a heat sink 20, and a first bracket 30. The main frame 10 is used to fix the motherboard 300. The motherboard 300 is provided with a first motherboard mounting portion (not shown) near the heat-generating device 301. The heat sink 20 is used to conduct heat to the heat-generating device 301 and to dissipate heat from the heat-generating device 301. The heat sink 20 is provided with a first heat sink mounting portion 20a. The first bracket 30 is used to connect the heat sink 20 and the motherboard 300. The heat sink 20 is fixed to the motherboard 300 by the first bracket 30, so that the position of the heat sink 20 relative to the heat-generating device 301 is fixed, rather than the heat sink 20 being directly fixed to the heat-generating device 301. There is no direct fixed connection between the heat sink 20 and the heat-generating device 301. The heat sink 20 only contacts the heat-generating device 301 to achieve heat dissipation.

[0022] The first bracket 30 is bent to form a first motherboard connecting section 31, a first intermediate section 32, and a first heat sink connecting section 33 connected in sequence. The first motherboard connecting section 31 has a first motherboard mating part 311, which is used to connect to the first motherboard mounting part. The relative position between the first motherboard mating part 311 and the first motherboard mounting part is adjustable, so that the first bracket 30 can be adjusted relative to the motherboard 300. The first heat sink connecting section 33 has a first heat sink mating part 331, which is used to connect to the first heat sink mounting part 20a. The relative position between the first heat sink mating part 331 and the first heat sink mounting part 20a is adjustable, so that the relative position between the first bracket 30 and the heat sink 20 is adjustable. Since the position of the first bracket 30 relative to the motherboard 300 is adjustable, and the position of the heat sink 20 relative to the first bracket 30 is also adjustable, the position of the heat sink 20 relative to the motherboard 300 can be adjusted. Furthermore, since the position of the heat-generating device 301 on the motherboard 300 is fixed, the position of the heat sink 20 relative to the heat-generating device 301 can be adjusted. This allows the heat sink 20 to be adjusted to a position that fully contacts the heat-generating device 301, thereby ensuring heat dissipation efficiency, compensating for manufacturing errors or human factors, and preventing the heat sink 20 from deviating from the heat-generating device 301 after installation. In addition, the position of the heat sink 20 can be adjusted to avoid other components in the server 200, which is beneficial for the placement of various components in the server 200, thereby improving the space utilization rate in the server 200.

[0023] In some embodiments, please refer to Figures 1 to 3. The specific method A for adjusting the position of the first bracket 30 relative to the motherboard 300 is as follows: The motherboard housing 100 also includes screws. The first motherboard mounting portion is a screw hole, and the first motherboard mating portion 311 is a slotted hole. The area of ​​the slotted hole is larger than the area of ​​the screw hole. Specifically, the width of the slotted hole is the same as the diameter of the screw hole, and the length of the slotted hole is greater than the diameter of the screw hole. The screw hole is selectively aligned with any position of the slotted hole, making the position of the first bracket 30 relative to the motherboard 300 adjustable. After adjustment to the desired position, the screw passes through the slotted hole and threadedly engages with the screw hole. The head of the screw is used to press against the first motherboard connecting section 31, making the first motherboard connecting section 31 tightly against the motherboard 300, thereby fixing the relative position between the first bracket 30 and the motherboard 300.

[0024] In some embodiments, please refer to Figures 1 to 3. The specific method B for adjusting the position of the first bracket 30 relative to the heat sink 20 is as follows: The main housing 100 also includes screws. The first heat sink mounting portion 20a is a screw hole, and the first heat sink mating portions 331 are all oblong holes. The area of ​​the oblong hole is larger than the area of ​​the screw hole. Specifically, the width of the oblong hole is the same as the diameter of the screw hole, and the length of the oblong hole is greater than the diameter of the screw hole. The screw hole is selectively aligned with any position of the oblong hole, making the position of the first bracket 30 relative to the heat sink 20 adjustable. After adjustment to the desired position, the screw passes through the oblong hole and threadedly engages with the screw hole. The head of the screw is used to press the first heat sink connecting section 33, so that the first heat sink connecting section 33 is tightly attached to the heat sink 20, thereby fixing the relative position between the first bracket 30 and the heat sink 20.

[0025] In some embodiments, referring to FIG4, the specific method C for adjusting the position of the first bracket 30 relative to the motherboard 300 is as follows: the motherboard housing 100 further includes screws, the first motherboard mounting portion is a screw hole, and the first motherboard mating portion 311 is a plurality of through holes, each through hole having the same diameter as the screw hole. The screw hole is selectively aligned with any one of the through holes, so that the position of the first bracket 30 relative to the motherboard 300 is adjustable. After being adjusted to the desired position, the screw passes through the through hole and is threaded into the screw hole. The head of the screw is used to press the first motherboard connecting section 31, so that the first motherboard connecting section 31 is tightly attached to the motherboard 300, thereby fixing the relative position between the first bracket 30 and the motherboard 300.

[0026] In some embodiments, referring to FIG4, the specific method D for adjusting the position of the first bracket 30 relative to the heat sink 20 is as follows: the main housing 100 further includes screws, the first heat sink mounting part 20a is a screw hole, and the first heat sink mating part 331 consists of multiple through holes, each through hole having the same diameter as the screw hole. The screw hole is selectively aligned with any one of the through holes, so that the position of the first bracket 30 relative to the heat sink 20 is adjustable. After being adjusted to the desired position, the screw passes through the through hole and is threaded into the screw hole. The head of the screw is used to press the first heat sink connecting section 33, so that the first heat sink connecting section 33 is in close contact with the heat sink 20, thereby fixing the relative position between the first bracket 30 and the heat sink 20.

[0027] In some embodiments, please refer to FIG5. The specific method E for adjusting the position of the first bracket 30 relative to the heat sink 20 is as follows: the first heat sink mounting part 20a and the first heat sink mating part 331 are both ball holes. The main housing 100 also includes a ball head rod 40. Ball heads are respectively provided at both ends of the ball head rod 40. The ball head at one end of the ball head rod is located in the ball hole of the first heat sink mounting part 20a, and the ball head at the other end of the ball head rod 40 is located in the ball hole of the first heat sink mating part 331. The ball head can rotate in the ball hole, so that the ball head rod 40 can swing relative to the first bracket 30 and the heat sink 20, thereby making the relative position between the first bracket 30 and the heat sink 20 adjustable.

[0028] In some embodiments, please refer to Figures 2 and 3. The projections of the first motherboard connecting segment 31, the first intermediate segment 32, and the first heat sink connecting segment 33 onto the motherboard 300 extend along the same straight line L. The first motherboard connecting segment 31 and the first heat sink connecting segment 33 are parallel to the motherboard 300 to facilitate the processing and production of the first bracket 30. Since the heat-generating device 301 has thickness, there must be a height difference between the first motherboard connecting segment 31 and the first heat sink connecting segment 33 relative to the motherboard 300. The first intermediate segment 32 can compensate for this height difference. Furthermore, the first intermediate segment 32 is inclined relative to the first motherboard connecting segment 31 and the first heat sink connecting segment 33. The included angle W between the first intermediate segment 32 and the first motherboard connecting segment 31 is an obtuse angle. Compared with a right angle, this can reduce the risk of stress concentration and improve the stability of the first bracket 30.

[0029] In some embodiments, please refer to Figures 2 and 6. When the heat-generating device 301 is a central processing unit, the heat-generating device 301 is rectangular in shape. Therefore, the heat sink 20 is also rectangular in shape. In order to improve the stability of the heat sink 20 relative to the heat-generating device 301, an additional number of supports need to be added on the basis of the first support 30. For example, the main unit housing 100 also includes a second support 50, a third support 60 and a fourth support 70. The second support 50 has a second main board mating part 51 and a second heat sink mating part 52. The third support 60 has a third main board mating part 61 and a third heat sink mating part 62. The fourth support 70 has a fourth main board mating part 71 and a fourth heat sink mating part 72.

[0030] Correspondingly, the motherboard 300 is also provided with a second motherboard mounting part, a third motherboard mounting part and a fourth motherboard mounting part (not shown in the figure), and the heat sink 20 is also provided with a second heat sink mounting part 20b, a third heat sink mounting part 20c and a fourth heat sink mounting part 20d. The second bracket 50 is connected to the second motherboard mounting part and the second heat sink mounting part 20b by means of the second motherboard mating part 51 and the second heat sink mating part 52. The third bracket 60 is connected to the third motherboard mounting part and the third heat sink mounting part 20c by means of the third motherboard mating part 61 and the third heat sink mating part 62. The fourth bracket 70 is connected to the fourth motherboard mounting part and the fourth heat sink mounting part 20d by means of the fourth motherboard mating part 71 and the fourth heat sink mating part 72. The first bracket 30, the second bracket 50, the third bracket 60 and the fourth bracket 70 are respectively provided at the four right angles of the heat sink 20 to improve stability.

[0031] Wherein, the second bracket 50, the third bracket 60 and the fourth bracket 70 may have the same structure as the first bracket 30, the second motherboard mounting part, the third motherboard mounting part and the fourth motherboard mounting part may have the same structure as the first motherboard mounting part, and the second heat sink mounting part 20b, the third heat sink mounting part 20c and the fourth heat sink mounting part 20d may have the same structure as the first heat sink mounting part 20a. Of course, the first bracket 30, the second bracket 50, the third bracket 60, and the fourth bracket 70 can also be different. They can be selected from methods A to E according to different usage scenarios. For example, the first bracket 30 and the third bracket 60 diagonally are the same, and the first bracket 30 and the third bracket 60 are fixed to the motherboard 300 and the heat sink 20 in methods A and B. The second bracket 50 and the fourth bracket 70 diagonally are the same, and the second bracket 50 and the fourth bracket 70 are fixed to the motherboard 300 and the heat sink 20 in methods A and E. Since method E does not require screws, it can improve the ease of operation while ensuring stability.

[0032] In some embodiments, please refer to Figures 1 and 2. The heat sink 20 includes a lower plate portion 21 and an upper plate portion 22. The lower plate portion 21 and the upper plate portion 22 are covered to form a complete heat sink 20. The lower plate portion 21 has a receiving cavity 21a on one side facing the upper plate portion 22. The upper plate portion 22 has a liquid inlet hole 22a and a liquid outlet hole 22b. The liquid inlet hole 22a and the liquid outlet hole 22b are connected to the receiving cavity 21a. The side of the lower plate portion 21 away from the upper plate portion 22 is attached to the heat-generating device 301. The coolant enters the receiving cavity 21a through the liquid inlet hole 22a and flows out from the liquid outlet hole 22b. The coolant absorbs the heat of the heat-generating device 301.

[0033] Further optionally, the lower plate 21 is provided with a plurality of spaced columns 211 in the receiving cavity 21a. The columns 211 are used to reduce the flow rate of the coolant, so that the coolant stays in the receiving cavity 21a for a longer time, so as to absorb more heat from the heat-generating device 301 and improve the heat transfer efficiency.

[0034] Further optionally, the cross-section of the receiving cavity 21a is circular, and a column 211 is provided at the center of the receiving cavity 21a. The receiving cavity 21a forms rings of different diameters around the center, and the remaining multiple columns 211 are arranged along each ring. The liquid inlet hole 22a and the liquid outlet hole 22b are symmetrically arranged with respect to the axis of the receiving cavity 21a, so that the columns 211 can be distributed more evenly to reduce the flow rate of the coolant more efficiently.

[0035] In some embodiments, the lower plate portion 21 is provided with a lower mounting hole 21b, and the upper plate portion 22 is provided with an upper mounting hole 22c. The lower mounting hole 21b and the upper mounting hole 22c are aligned and used to install screws to fix the lower plate portion 21 and the upper plate portion 22, thereby forming a complete heat sink 20.

[0036] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the spirit and scope of this application shall fall within the scope of disclosure of this application. [Simplified Explanation of the Diagram]

[0037] Figure 1 is a perspective view of a portion of the server and host housing in one embodiment of this application.

[0038] Figure 2 is an exploded view of the heat sink and various brackets in the main unit casing of Figure 1.

[0039] Figure 3 is a three-dimensional view of the first support in Figure 2.

[0040] Figure 4 is a perspective view of the first bracket in another embodiment of this application.

[0041] Figure 5 is a cross-sectional view of the first bracket and heat sink in another embodiment of this application.

[0042] Figure 6 is a top view of the heat sink and various brackets in the main unit casing of Figure 1.

Claims

1. A host housing, wherein the improvement is that the host housing comprises: The main frame is configured to mount a main board, the main board having a heating element, and the main board having a first main board mounting part; A heat sink is configured to make thermal contact with the heat-generating device to dissipate heat from the heat-generating device, and the heat sink is provided with a first heat sink mounting portion; A first bracket connects the heat sink to the motherboard, and the heat sink is fixed to the motherboard by the first bracket to fix the position of the heat sink relative to the heat-generating device. The first bracket is bent to form a first motherboard connecting section, a first intermediate section, and a first heat sink connecting section connected in sequence. The first motherboard connecting section has a first motherboard mating part, and the first heat sink connecting section has a first heat sink mating part. The first motherboard mating part is used to connect to the first motherboard mounting part, and the relative position between the first motherboard mating part and the first motherboard mounting part is adjustable. The first heat sink mating part is used to connect to the first heat sink mounting part, and the relative position between the first heat sink mating part and the first heat sink mounting part is adjustable, so that the position of the heat sink relative to the heat-generating device is adjustable. The main unit housing also includes screws. The first main board mounting portion is a screw hole, and the first main board mating portion is a slotted hole. The area of ​​the slotted hole is larger than the area of ​​the screw hole. The screw hole can be selectively aligned with any position of the slotted hole, so that the position of the first bracket relative to the main board is adjustable. The screw passes through the slotted hole and is threaded into the screw hole. The head of the screw is used to press the first main board connecting section to fix the first bracket and the main board. The first heat sink mounting portion is a screw hole, and the first heat sink mating portions are all slotted holes. The area of ​​the slotted hole is larger than the area of ​​the screw hole. The screw hole can be selectively aligned with any position of the slotted hole, so that the position of the first bracket relative to the heat sink is adjustable. The screw passes through the slotted hole and is threaded into the screw hole. The head of the screw is used to press the first heat sink connecting section to fix the first bracket and the heat sink. The projections of the first motherboard connecting segment, the first intermediate segment, and the first heat sink connecting segment onto the motherboard extend along the same straight line. The first motherboard connecting segment and the first heat sink connecting segment are parallel to the motherboard. There is a height difference between the first motherboard connecting segment and the first heat sink connecting segment relative to the motherboard. The first intermediate segment is inclined relative to the first motherboard connecting segment and the first heat sink connecting segment. The included angle between the first intermediate segment and the first motherboard connecting segment is an obtuse angle.

2. The host casing as described in claim 1, wherein: The heat sink includes a lower plate and an upper plate, the lower plate and the upper plate are covered by the lower plate, the lower plate has a cavity on one side facing the upper plate, the upper plate has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are connected to the cavity, the lower plate is attached to the heat-generating device on one side away from the upper plate, and the coolant enters the cavity through the liquid inlet and flows out through the liquid outlet.

3. The host casing as described in claim 2, wherein: The lower plate has multiple spaced columns in the receiving cavity, and the columns reduce the flow rate of the coolant.

4. The host casing as described in claim 3, wherein: The cross-section of the receiving cavity is circular, and a column is provided at the center of the receiving cavity. Loops of different diameters are formed around the center of the receiving cavity, and the remaining columns are arranged along each of the loops. The liquid inlet and the liquid outlet are symmetrically arranged with respect to the axis of the receiving cavity.

5. The host casing as described in claim 1, wherein: The heat sink is rectangular. The motherboard also has a second motherboard mounting portion, a third motherboard mounting portion, and a fourth motherboard mounting portion that are identical to the first motherboard mounting portion. The heat sink also has a second heat sink mounting portion, a third heat sink mounting portion, and a fourth heat sink mounting portion that are identical to the first heat sink mounting portion. The motherboard housing also includes a second bracket, a third bracket, and a fourth bracket that are identical to the first bracket. The second bracket is correspondingly connected to the second motherboard mounting portion and the second heat sink mounting portion. The third bracket is correspondingly connected to the third motherboard mounting portion and the third heat sink mounting portion. The fourth bracket is correspondingly connected to the fourth motherboard mounting portion and the fourth heat sink mounting portion. The first bracket, the second bracket, the third bracket, and the fourth bracket are respectively located at the four right angles of the heat sink.

6. A server, improved in that: the server includes a board and a host housing as described in any one of claims 1 to 5.

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